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Equipment testing method and device, readable medium and electronic equipment

A technology for equipment testing and testing, applied in the computer field, can solve the problems of low testing efficiency, complex structure, and high testing cost, and achieve the effect of improving testing efficiency, high-efficiency equipment problems, and reducing testing cost.

Pending Publication Date: 2021-12-03
BEIJING BYTEDANCE NETWORK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the memory module, it is difficult to find the problem in the normal environment, but it is easier to test the problem in the high temperature and high humidity environment
However, in related technologies, the structure of the high-temperature and high-humidity environment is relatively complicated, resulting in high test costs and low test efficiency

Method used

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  • Equipment testing method and device, readable medium and electronic equipment
  • Equipment testing method and device, readable medium and electronic equipment
  • Equipment testing method and device, readable medium and electronic equipment

Examples

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Embodiment Construction

[0043] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the drawings, it should be understood that the disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein; A more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are for exemplary purposes only, and are not intended to limit the protection scope of the present disclosure.

[0044] It should be understood that the various steps described in the method implementations of the present disclosure may be executed in different orders, and / or executed in parallel. Additionally, method embodiments may include additional steps and / or omit performing illustrated steps. The scope of the present disclosure is not limited in this respect. ...

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PUM

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Abstract

The invention relates to an equipment testing method and device, a readable medium and electronic equipment. The method comprises the following steps: acquiring equipment test parameters corresponding to target equipment; obtaining a target parameter value corresponding to the equipment test parameter in a to-be-tested environment; and then testing the target equipment in the current environment according to the target parameter value to obtain a test result of the target equipment in the to-be-tested environment, wherein the current environment is different from the environment to be tested. Therefore, by setting the target parameter value of the equipment test parameter in the current conventional environment and simulating the equipment test in the to-be-tested environment, the same test effect as that in the actual to-be-tested environment can be obtained, so that the equipment problem can be found more efficiently, the test cost is reduced, and the test efficiency is also improved.

Description

technical field [0001] The present disclosure relates to the field of computer technology, and in particular, relates to a device testing method, device, readable medium and electronic device. Background technique [0002] With the development and progress of Internet technology, many target servers need to be used to provide services to users. In order to ensure the reliability and availability of target servers, more stress tests will be done during the development and production of target servers. However, after stress testing the target server in a conventional environment, there will still be a problem of high failure rate of the target server in actual use. In order to better discover the failure of the target server through the stress test, the stress test can be carried out in a high-temperature and high-humidity environment. The high-temperature and high-humidity environment can make it easier for problematic modules to expose problems. For example, memory modules ...

Claims

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Application Information

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IPC IPC(8): G06F11/22G06F11/36
CPCG06F11/2205G06F11/2289G06F11/3664
Inventor 葛士建刘显张宇聂海涛许晓菡袁帅李琛琛王亚彬彭亮王剑
Owner BEIJING BYTEDANCE NETWORK TECH CO LTD
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