Electronic component manufacturing equipment

A technology for electronic components and manufacturing equipment, which is applied in the field of electronic component manufacturing equipment, can solve the problems of reducing equipment sealing requirements, failing to reduce defective rate, increasing chip plastic packaging, etc., so as to avoid overflow of plastic packaging materials and reduce sealing performance Requirements, the effect of improving the yield
CN113745136AActive Publication Date: 2021-12-03张家港谱析传感科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
张家港谱析传感科技有限公司
Publication Date
2021-12-03

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Abstract

The invention discloses electronic component manufacturing equipment which comprises an operation table, a supporting column is fixedly connected to the bottom of the operation table, a bottom mold is installed at the top of the operation table, a supporting frame is fixedly connected to the top of the operation table, an upper mold is installed at the bottom of the supporting frame through an oil cylinder, and an injection molding pipe is installed at the top of the upper mold. The injection molding pipe penetrates through the upper mold and extends to the interior of the upper mold; and a heating device, a sealing device and a material pressing device are arranged above the operation table; and the invention relates to the technical field of electronic product production. According to the electronic component manufacturing equipment, the purpose of reducing the defective rate is achieved, the problem that a chip is prone to being damaged due to the fact that the distance between heating equipment and the chip is short is solved, plastic package material overflow in the chip plastic package process can be reduced, the processing difficulty after chip plastic package is lowered, the requirement for the sealing performance of the equipment is lowered, and the cost of the equipment is lowered; the plastic packaging density of the chip can be increased, and the plastic packaging quality of the chip can be improved.
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Description

technical field

[0001] The invention relates to the technical field of electronic product production, in particular to electronic component manufacturing equipment. Background technique

[0002] There are many classifications of electronic components. Individual devices such as resistors and capacitors are called basic devices, while chips integrate many basic devices into a very small circuit board, so they are also called integrated circuits. The chip is small in size. It is the most important part of electronic products, which undertakes the functions of calculation and storage. The complete process of chip production includes chip design, chip production, packaging production, cost testing and other links. Among them, chip packaging is installed outside the semiconductor integrated circuit chip. A shell, so as to place, fix, seal, protect and enhance the electrothermal performance of the chip, and the packaging process is also a bridge to communicate the internal world o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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