Electronic component manufacturing equipment

A technology for electronic components and manufacturing equipment, which is applied in the field of electronic component manufacturing equipment, can solve the problems of reducing equipment sealing requirements, failing to reduce defective rate, increasing chip plastic packaging, etc., so as to avoid overflow of plastic packaging materials and reduce sealing performance Requirements, the effect of improving the yield

Active Publication Date: 2021-12-03
张家港谱析传感科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an electronic component manufacturing equipment, which solves the problem that the existing electronic component manufacturing equipment cannot reduce the defective rate, and the heating equipment is close to the chip and the chip is easy to be damaged. The ove

Method used

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  • Electronic component manufacturing equipment
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Examples

Experimental program
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Effect test

Embodiment 1

[0039] see Figure 1-5 , the present invention provides a technical solution: a kind of electronic component manufacturing equipment, including an operation table 1, the bottom of the operation table 1 is fixedly connected with a support column 2, the top of the operation table 1 is equipped with a bottom mold 3, and the top of the operation table 1 The support frame 4 is fixedly connected, the bottom of the support frame 4 is equipped with an upper mold 5 through the oil cylinder 10, the top of the upper mold 5 is equipped with an injection pipe 6, the injection pipe 6 runs through the upper mold 5 and extends to the inside of the upper mold 5, and the operation table 1 The above settings are:

[0040] Heating device 7, the heating device 7 has a heating block 71, the heating block 71 is symmetrically installed on both sides of the inner wall of the bottom mold 3, the top of the console 1 is provided with a rotating groove 72, and the inner wall of the rotating groove 72 is s...

Embodiment 2

[0048] see Figure 1-8 , the present invention provides a technical solution: on the basis of Embodiment 1, a pressing device 9 is arranged above the operating table 1, and the pressing device 9 has a pressing plate 91, and the inner wall of the pressing plate 91 and the upper mold 5 Slidingly connected, both sides of the inner wall of the upper mold 5 are provided with a locking groove 92, and one side of the inner wall of the locking groove 92 is fixedly connected with a locking block 94 through an outwardly pushing spring 93, and the bottom of the locking block 94 is an arc surface. Both sides of the material plate 91 are provided with locking grooves 95 adapted to the locking blocks 94 , and the injection tube 6 runs through the pressure material plate 91 .

[0049] One end of the top of the injection tube 6 is sleeved with an outer tube 15 , the outer tube 15 is slidingly connected with the injection tube 6 , and the bottom of the outer tube 15 is fixedly connected with t...

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Abstract

The invention discloses electronic component manufacturing equipment which comprises an operation table, a supporting column is fixedly connected to the bottom of the operation table, a bottom mold is installed at the top of the operation table, a supporting frame is fixedly connected to the top of the operation table, an upper mold is installed at the bottom of the supporting frame through an oil cylinder, and an injection molding pipe is installed at the top of the upper mold. The injection molding pipe penetrates through the upper mold and extends to the interior of the upper mold; and a heating device, a sealing device and a material pressing device are arranged above the operation table; and the invention relates to the technical field of electronic product production. According to the electronic component manufacturing equipment, the purpose of reducing the defective rate is achieved, the problem that a chip is prone to being damaged due to the fact that the distance between heating equipment and the chip is short is solved, plastic package material overflow in the chip plastic package process can be reduced, the processing difficulty after chip plastic package is lowered, the requirement for the sealing performance of the equipment is lowered, and the cost of the equipment is lowered; the plastic packaging density of the chip can be increased, and the plastic packaging quality of the chip can be improved.

Description

technical field [0001] The invention relates to the technical field of electronic product production, in particular to electronic component manufacturing equipment. Background technique [0002] There are many classifications of electronic components. Individual devices such as resistors and capacitors are called basic devices, while chips integrate many basic devices into a very small circuit board, so they are also called integrated circuits. The chip is small in size. It is the most important part of electronic products, which undertakes the functions of calculation and storage. The complete process of chip production includes chip design, chip production, packaging production, cost testing and other links. Among them, chip packaging is installed outside the semiconductor integrated circuit chip. A shell, so as to place, fix, seal, protect and enhance the electrothermal performance of the chip, and the packaging process is also a bridge to communicate the internal world o...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/56B29C43/18B29C43/36B29C43/52
CPCH01L21/67121H01L21/56H01L21/565B29C43/18B29C43/36B29C43/52B29C2043/182
Inventor 施惠民施毅姜鹏飞江叶童
Owner 张家港谱析传感科技有限公司
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