Electronic component manufacturing equipment

Abstract

The invention discloses electronic component manufacturing equipment which comprises an operation table, a supporting column is fixedly connected to the bottom of the operation table, a bottom mold is installed at the top of the operation table, a supporting frame is fixedly connected to the top of the operation table, an upper mold is installed at the bottom of the supporting frame through an oil cylinder, and an injection molding pipe is installed at the top of the upper mold. The injection molding pipe penetrates through the upper mold and extends to the interior of the upper mold; and a heating device, a sealing device and a material pressing device are arranged above the operation table; and the invention relates to the technical field of electronic product production. According to the electronic component manufacturing equipment, the purpose of reducing the defective rate is achieved, the problem that a chip is prone to being damaged due to the fact that the distance between heating equipment and the chip is short is solved, plastic package material overflow in the chip plastic package process can be reduced, the processing difficulty after chip plastic package is lowered, the requirement for the sealing performance of the equipment is lowered, and the cost of the equipment is lowered; the plastic packaging density of the chip can be increased, and the plastic packaging quality of the chip can be improved.

Description

technical field [0001] The invention relates to the technical field of electronic product production, in particular to electronic component manufacturing equipment. Background technique [0002] There are many classifications of electronic components. Individual devices such as resistors and capacitors are called basic devices, while chips integrate many basic devices into a very small circuit board, so they are also called integrated circuits. The chip is small in size. It is the most important part of electronic products, which undertakes the functions of calculation and storage. The complete process of chip production includes chip design, chip production, packaging production, cost testing and other links. Among them, chip packaging is installed outside the semiconductor integrated circuit chip. A shell, so as to place, fix, seal, protect and enhance the electrothermal performance of the chip, and the packaging process is also a bridge to communicate the internal world o...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an electronic component manufacturing equipment, which solves the problem that the existing electronic component manufacturing equipment cannot reduce the defective rate, and the heating equipment is close to the chip and the chip is easy to be damaged. The overflow of the plastic packaging material during the chip plastic packaging process reduces the difficulty of handling the chip after plastic packaging, reduces the sealing requirements for the equipment, reduces the cost of the equipment, increases the density of the chip plastic packaging, and improves the quality of the chip plastic packaging

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