Driving backboard, display panel and manufacturing method of driving backboard

A technology for driving backplanes and substrates, which is applied in the field of display panels and display panel production and driving backplanes, can solve the problems affecting the driving effect of the driving backplane, the high impedance of the second conductive layer, and the limitation, so as to improve the driving effect and reduce the The effect of self-impedance

Pending Publication Date: 2021-12-03
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In related technical solutions, the two conductive layers used to connect to the positive and negative electrodes of the external MicroLED chip in the drive backplane are formed by patterning the same metal layer, and are used to connect the second conductive layer to the negative electrode of the power supply. The range of layers t

Method used

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  • Driving backboard, display panel and manufacturing method of driving backboard
  • Driving backboard, display panel and manufacturing method of driving backboard
  • Driving backboard, display panel and manufacturing method of driving backboard

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0045] Example 1

[0046] See figure 1 Combine figure 2 , The present embodiment is a main backplane driver for driving the light emitting member 900, in the present embodiment, the backplane drive comprising:

[0047] The substrate 100;

[0048] Thin film transistor layer 200, the thin film transistor layer 200 is disposed on the substrate 100, the thin film transistor layer 200 includes a source drain metal layer 208;

[0049] The first conductive layer 300 and the second conductive layer 400, the first conductive layer 300 and the second conductive layer 400 disposed on the upper substrate 100, a first conductive layer 300 and the source drain metal layer 208 is electrically connected to the first conductive layer 300 is electrically connected to the positive electrode 900 of the light emitting member, said second conductive layer 400 for connection with the negative electrode 900 of the light emitting member, and the first conductive layer 300 the second conductive layer 400 a...

Example Embodiment

[0071] Example 2

[0072] See figure 2 In this particular embodiment, a display panel is also provided as a display panel provided in Example 2, and Embodiment 2, including a light-emitting member 900, further comprising a driving back plate as described in Example 1, the light-emitting component 900 has The positive electrode connection end and the negative electrode connection end, the positive electrode connection is electrically connected to the first conductive layer 300, which is electrically connected to the second conductive layer 400.

[0073] Wherein, the light-emitting member 900 is specifically a MicroLeD chip, and the implement person can replace the above MicroLED chip as a miniled chip or an organic light emitting diode.

Example Embodiment

[0074] Example 3

[0075] Please combine Figure 3 to 11 This specific embodiment also provides a method of making a driving backplane, including steps:

[0076] A substrate 100 is provided;

[0077] A thin film transistor layer 200 is fabricated on the substrate 100, and a first conductive layer 300 for electrically connecting to the light-emitting member 900 is provided on the thin film transistor and a first conductive layer 300 for electrically connecting to the light-emitting component 900 negative electrode. The two conductive layer 400, wherein the first conductive layer 300 and the second conductive layer 400 are disposed.

[0078] Among them, a thin film transistor layer 200 is fabricated on the substrate 100 for electrically connecting a first conductive layer 300 that is electrically connected to the light-emitting member 900 and is electrically connected to the light-emitting component 900 negative electrode electrical connection second conductive layer 400, specificall...

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Abstract

The invention provides a driving backboard, a display panel and a manufacturing method of the driving backboard, and relates to the technical field of display devices. The driving backboard, the display panel and the driving backboard manufacturing method provided by the invention mainly improve the arrangement position of the conductive layer in the driving backboard. In the embodiment provided by the invention, the first conductive layer is used for being electrically connected with the positive electrode of the light-emitting part, and the second conductive layer is electrically connected with the negative electrode of the light-emitting part. According to the embodiment of the invention, the settable range of the second conductive layer and the thickness of the film layer are expanded, so that the second conductive layer can reduce the impedance of the second conductive layer by expanding the setting range of the second conductive layer and the thickness of the film layer, so that the driving effect of the driving backboard is improved.

Description

technical field [0001] The present invention relates to the technical field of display devices, in particular to a driving backplane, a display panel and a method for manufacturing the display panel. Background technique [0002] Micro LED display technology has the advantages of high brightness, good stability, and wide color gamut. It is widely recognized as the next generation of new display technology and is expected to be widely used in many fields. For the Micro LED current-driven display technology, it mainly establishes a connection with an external Micro LED chip through a conductive layer, thereby driving the Micro LED chip to emit light. In related technical solutions, the two conductive layers used to connect to the positive and negative electrodes of the external MicroLED chip in the drive backplane are formed by patterning the same metal layer, and are used to connect the second conductive layer to the negative electrode of the power supply. The range of layer...

Claims

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Application Information

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IPC IPC(8): H01L27/15H01L29/786H01L33/62
CPCH01L27/156H01L33/62H01L29/78633H01L2933/0066
Inventor 梅雪茹
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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