Supercharge Your Innovation With Domain-Expert AI Agents!

Chip surface scratch defect detection method and device and computer equipment

A chip and scratch technology, used in computer parts, computing, character and pattern recognition, etc., can solve the problems of low detection accuracy and false detection, and achieve high detection accuracy, strong anti-interference, and superior detection performance. Effect

Pending Publication Date: 2021-12-10
CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
View PDF9 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing computer image processing methods are usually based on threshold segmentation and morphology, which are prone to false detection and low detection accuracy.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip surface scratch defect detection method and device and computer equipment
  • Chip surface scratch defect detection method and device and computer equipment
  • Chip surface scratch defect detection method and device and computer equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0031]The current scratch defect detection method is mainly based on the method of threshold segmentation, and the chip defect image is binarized to separate the scratch position. However, since threshold segmentation only uses the threshold of the image and does not consider other image features, the image segmentation effect is poor for images with no obvious pixel differences between the target and the background (that is, low-contrast defect areas), and is susceptible to noise interference and illumination. conditional impact. However, the scratch area on the chip is ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a chip surface scratch defect detection method and device, computer equipment and a storage medium. The method comprises the following steps: acquiring an original image of a to-be-detected chip, and preprocessing the original image to obtain a preprocessed image; clustering pixels according to the similarity among the pixels in the preprocessed image to obtain a plurality of superpixels; performing significance analysis on the preprocessed image according to the plurality of superpixels to obtain a salient image; performing threshold segmentation on the salient image to separate a target foreground image containing chip surface scratches from a target background image, wherein the target foreground image is a chip surface scratch image obtained through detection. By adopting the method, the detection accuracy of scratches on the surface of a chip is high, and the robustness is strong.

Description

technical field [0001] The present application relates to the field of chip technology, and in particular to a detection method, device, computer equipment and storage medium for chip surface scratch defects. Background technique [0002] With the rapid development and widespread use of the modern electronics industry, the demand for chips continues to rise. However, chips are prone to some surface defects during production and transportation, which will affect their subsequent working performance. Traditional detection methods are mainly based on manual visual inspection, which not only has low detection efficiency and poor accuracy, but also is easily affected by human subjective factors, which makes it difficult to meet the actual detection needs of modern industries. [0003] As an important branch of artificial intelligence technology, computer vision can replace the human eye for detection and recognition, that is, to obtain images through visual modules (cameras, len...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06T7/00G06T7/11G06T7/136G06T7/90G06T5/00G06K9/62
CPCG06T7/11G06T7/0004G06T7/136G06T7/90G06F18/23G06T5/70
Inventor 赵玥罗军王小强罗道军唐锐
Owner CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com