Method for manufacturing pre-cut SDB FinFET
A manufacturing method and oxide layer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as device performance degradation, and achieve the effects of reduced pressure release risk and good filling ability
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[0064] The embodiments of the present invention will be described below with reference to the specific examples of the present invention, and those skilled in the art can easily understand other advantages and efficacy of the present invention. The present invention can also be implemented or applied by other embodiments, and various details in this specification may also be based on different viewpoints and applications without departing from the spirit of the invention.
[0065] Please refer to Figure 2 to Figure 17 . It should be noted that the illustrations provided in the present embodiment will only illustrate the basic contemplation of the present invention, and only the components, shapes, shapes, and in accordance with the components of the present invention are shown in the schematic manner. Dimensions, the type, number, and proportion of each component can be a random change in the actual implementation of the actual implementation, and its component layout may be more ...
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