Water-cooling heat dissipation device with adjustable water resistance

Abstract

The invention relates to the technical field of heat dissipation devices, in particular to a water-cooling heat dissipation device with adjustable water resistance; the device comprises a base used for conducting heat dissipation on a heating electronic element, a cover plate fixed to the base, a water inlet pipe and a water outlet pipe. A plurality of channels are formed in the face, facing the cover plate, of the base and communicate with one another to form a main flow channel, and the main flow channel communicates with the water inlet pipe and the water outlet pipe. A blocking block is detachably arranged in the main flow channel and isolates circulation of liquid, so that the flow direction of the liquid in the main flow channel is adjusted. A flow limiting block is detachably arranged in the channel, and the flow limiting block stops circulation of part of the channel, so that resistance in the channel is adjusted. The flow limiting block and the blocking block are detachably mounted, so that the effect of adjusting the water flow resistance and the flow direction is achieved.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a water-cooled radiator with adjustable water resistance. Background technique [0002] The water-cooled radiator is a component that exchanges heat through liquid cooling. The principle is to form a flow channel in the metal plate, the electronic components are installed on the surface of the plate, and the cooling liquid flows in the circulation of the metal plate to bring the heat generated by the electronic components to Walk. [0003] Traditional water-cooled radiators mostly use machining to process cooling fins to form flow channels. Such flow channel design usually has the following problems: 1. Due to the uneven distribution of coolant flow, there is a huge difference in the heat dissipation capacity of different positions on the metal plate; 2. The conventional rectangular fins in the flow channel will cause excessive water resistance, resulting in matching The cost...

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Problems solved by technology

Such flow channel design usually has the following problems: 1. Due to the uneven distribution of coolant flow, there is a huge difference in the heat dissipation capacity of different positions on the metal plate; 2. The conventional rectangular fins in the flow channel will cause excessive water resistance, resulting in matching The cost of the auxiliary circulation system increases; 3. Due to the large number of electronic equipment models, the distribution of internal device heat sources is different, and the resistance cannot be adjusted. Therefore, it is necessary to specially design the corresponding flow channels for different types of equipment, resulting in high design costs. Production Long cycle, difficult to standardize

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