Rib-line-type radiator and manufacturing method

Abstract

The invention provides a rib-line-type radiator and a manufacturing method. The rib-line-type radiator is characterized by comprising rib lines (8) and a heat conduction fixed plate (7) or a ring-shrouding cover (1). Rib foot ends (3) of a plurality of rib lines (8) are inserted in a hole of the heat conduction fixed plate (7), and the sections of the rib foot ends (3) of the plurality of rib lines (8) are connected in a welding mode or the sections of the rib foot ends (3) of the plurality of rib lines (8) are tighten to a bundle, and the ring-shrouding cover (1) is covered outside the bundle, and then the ring-shrouding cover (1) is crimpled through a crimpling jig technology, and at last, a heat transfer contact surface (5) of the radiator is processed through turning or grinding until all end surfaces (4) of the rib feet and the bottom surface of the heat conduction fixed plate (7) or the bottom end surface of the ring-shrouding cover (1) is neat and smooth. The rib-line-type radiator is high in heat dispersion, simple in production technology, high in material using rate, and has an unprecedented significance in pushing forward with and popularizing a present semiconductor solid state lighting technology with high heat dissipation costs.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of semiconductor electronic devices. technical background [0002] As we all know, today's semiconductor electronic technology is developing rapidly, the size is small, but the operating frequency or power is increasing, and the large temperature rise is steep and obvious. In order to make it work better, more stable, and have a long life Heat dissipation equipment is very important, such as computer CPU chips, graphics card chips, etc., especially the semiconductor solid-state lighting chips that are in full swing today. Reduced by 10%, it is urgent to solve its heat dissipation. [0003] Heat transfer and heat dissipation technology has been developed for nearly a hundred years, and people in the industry still inherit the foundation of their ancestors from generation to generation. Although traditional design structures and manufacturing methods can barely solve the problem of heat di...

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Problems solved by technology

[0003] Heat transfer and heat dissipation technology has been developed for nearly a hundred years, and people in the industry still inherit the foundation of their ancestors from generation to generation. Although traditional design structures and manufacturing methods can barely solve the problem of heat dissipation, the heat sink products are heavy and oversized. Too much waste will inevitably lead to a lot of waste of materials and high prices. This is contrary to the energy-saving and environmentally-friendly and energy-saving industrial development ideas that are vigorously advocated and advocated today. Light-weight, low-cost, high-performance cooling equipment will be the demand of the times. pet

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