Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Radiator and radiator group

A heat sink group and heat sink technology, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems that cannot meet the heat dissipation requirements of high-power chips, and solve the problem of air-cooled heat dissipation, Improve the heat dissipation capacity and improve the effect of convective heat transfer coefficient

Active Publication Date: 2015-07-01
河北永洋特钢集团有限公司
View PDF3 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, with the continuous improvement of chip power consumption, the traditional air-cooled heat dissipation method can no longer meet the heat dissipation requirements of high-power consumption chips.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radiator and radiator group
  • Radiator and radiator group
  • Radiator and radiator group

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0055] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0056] Embodiments of the present invention provide a radiator and a radiator group, which can improve the heat dissipation capacity of the radiator per unit volume and solve the problem of air cooling and heat dissipation of high power consumption chips.

[0057] First of all, it needs to be explained that the core idea of ​​the radiator provided by the embodiment of the present invention is to improve the convective heat transfer coefficient of the radiator by chang...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention discloses a radiator. An air guide cover is arranged to be vertical to a first micro channel, and a baffle is arranged above the air guide cover. The air guide cover comprises at least one air inlet channel and at least one air outlet channel, and the air inlet channels and the air outlet channels are arranged adjacent to each other and at intervals. The first micro channel comprises a bottom plate and at least two fins, the fins are erected on the bottom plate in parallel, and two adjacent fins form a radiating channel. The air inlet channels and the air outlet channels of the air guide cover and the radiating channels of the first micro channel perpendicularly intersect in arrangement. The embodiment of the invention further discloses a radiator group. According to the embodiment of the invention, the radiating capability per unit volume of the radiator can be improved, and the air-cooling radiating problem of a high-power-consumption chip can be solved.

Description

technical field [0001] The invention relates to the technical field of equipment heat dissipation, in particular to a radiator and a radiator group. Background technique [0002] Electronic equipment contains various electronic components. During the working process of the equipment, these electronic components will generate heat, which will cause the temperature of the device to rise. When the temperature of the device exceeds a certain value, it will cause overheating damage or abnormal function of the device. Therefore, appropriate cooling methods must be adopted to control the operating temperature of the device within an appropriate range. [0003] At present, the most common heat dissipation method is air cooling, which is to install a fan in the equipment chassis to drive air to flow through the heating surface of the device (or its radiator), and transfer the heat from the device out of the chassis to the air through convective heat exchange. Generally speaking, th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/467
Inventor 冯铭新郝明亮董愿
Owner 河北永洋特钢集团有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com