A high-efficiency dispensing method for power management chips

Abstract

The invention relates to a high-efficiency dispensing device and a dispensing method for power management chips, which belong to the technical field of dispensing processing. The invention provides a high-efficiency dispensing device and a dispensing method for power management chips, including a base , a guide frame is installed above the base, a dispensing mechanism is installed in the middle of the guide frame, and the glue dispensing mechanism is installed inside the guide frame through the first support frame. A transmission mechanism is installed in the upper middle of the base, and the transmission mechanism is a strip-shaped transmission device installed symmetrically on both sides of the base, and the first electric push rod drives the conveyor belt and the second motor to move in the middle of the base, changing the two The transmission width between the transmission mechanisms facilitates the transmission of chips of different widths, which facilitates the improvement of the transmission efficiency of the device, and protects the edges through the positioning mechanism on the transmission mechanism to avoid deviation of the chips during transmission and ensure that the chips The stable transmission is convenient for accurate and efficient dispensing work.

Description

technical field [0001] The invention relates to a high-efficiency glue dispensing device and a glue dispensing method for power management chips, belonging to the technical field of glue dispensing processing. Background technique [0002] Before the chip on the PCB board is soldered, a dispensing device is required to fix the position of the chip on the PCB board by dispensing glue to ensure that the position of the chip on the PCB board is more accurate and firm when it is welded, and to make the chip and PCB The fit of the board is better. [0003] The existing dispensing devices for chips on PCBs still have many deficiencies in use. Usually, the chips are prone to shaking during the transmission process on the conveyor belt, and the chips need to be repositioned after the transmission is completed. Glue dispensing leads to low dispensing efficiency. In addition, the existing dispensing devices need to move the chip to a specific position through the conveyor belt, then ...

AI Technical Summary

Problems solved by technology

[0003] Existing dispensing devices for chips on PCBs still have many deficiencies in use, and usually chips are prone to occur during the process of transferring chips on the conveyor belt Shaking, the chip needs to be repositioned after the transfer, and then the glue can be dispensed, resulting in a very low dispensing efficiency. In addition, the existing dispensing device needs to move the chip to a specific position through the transmission belt. The chip is removed from the conveyor belt and then dispensed. Glue cannot be dispensed during the transfer process. This requires a very large size of the workbench, which increases the floor space, and the conveyor belt can only transfer chips of a fixed size. Poor performance, and the dispensing nozzle on the existing dispensing device can only dispensing and fixing the chip on the PCB board with the same thickness and area, poor adaptability, and the parts on the dispensing device can adjust the range of movement Small, poor flexibility of use

[0004] Chinese utility model patent with publication number CN213727485U, although it can realize dispensing on the conveyor belt, but in the process of dispensing, the conveyor belt needs to stop running, etc. The workpiece can only be transferred after dispensing, and the conveyor belt can not be kept working during the dispensing process, which seriously affects the processing efficiency

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