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Mainboard testing head

A technology of test head and main board, which is applied in the field of test head, can solve problems such as poor contact, damaged main board, and unsafe contact, and achieve the effects of avoiding physical collision damage, increasing contact area, and improving test accuracy

Active Publication Date: 2021-12-17
深圳市众博信发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional motherboard testing equipment uses hard probes to conduct contact tests on the motherboard. However, when the probe touches the motherboard, damage to the motherboard, unsafe contact, and poor contact often occur. This is the main reason for the traditional technology. shortcoming

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0013] Such as Figure 5 to Figure 7 As shown, a motherboard test head 400 is used to contact and test a motherboard A, and perform contact tests on the contacts, circuits, solder pads, etc. on the motherboard A.

[0014] The main board test head 400 includes a connection post 410, a probe 420 and a flexible sleeve 500, wherein the connection post 410 is connected between the test system 200 and the probe 420, and the probe 420 is inserted in the connection post 410, The flexible sheath 500 is set on the front end of the probe 420. The flexible sheath 500 is made of elastic material, such as silicone, elastic resin, etc. The flexible sheath 500 can conduct electricity, so that the flexible sheath 500 can be electrically connected to the probe 420. connected.

[0015] When working, the flexible sleeve 500 first contacts the point to be tested, and then the flexible sleeve 500 is deformed under pressure to increase the contact area between the flexible sleeve 500 and the point ...

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PUM

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Abstract

The invention relates to a mainboard testing head, which comprises a connecting column, a probe and a flexible sleeve, the probe is inserted into the connecting column, the flexible sleeve sleeves the front end of the probe, the flexible sleeve is made of an elastic material, the flexible sleeve is provided with an outer surface, an inner surface and a front end surface, and a sleeve cavity is formed by the inner surface in a surrounding manner. The probe is inserted into the sleeve cavity, a deformation contact cavity is formed at the front end of the probe and in the sleeve cavity, a conductive layer is arranged on the inner surface of the flexible sleeve, during testing, the mainboard testing head moves towards the direction of a tested point, and after the flexible sleeve is completely contacted with the tested point, the testing action is performed. In the process that the flexible sleeve makes contact with the tested point, firstly, the front end face makes contact with the tested point, then, the flexible sleeve continues to move, and the deformation contact cavity is pressed to deform so that the conductive layer can wrap the outer surface of the tested point to increase the contact area.

Description

technical field [0001] The invention relates to a test head, in particular to a test head for detecting a main board. Background technique [0002] Motherboards are also called machine boards, system boards or motherboards, which are generally divided into two types: commercial motherboards and industrial motherboards. The motherboard is installed in the chassis or equipment, and is one of the most basic and important components of microcomputers, automation equipment, servers, etc. The motherboard is generally a rectangular circuit board, on which are installed the main circuit systems that make up the computer. Generally, there are BIOS chips, I / O control chips, keyboard and panel control switch interfaces, indicator light connectors, expansion slots, motherboards and cards. DC power supply connectors and other components. The motherboard generally adopts an open structure. Most of the motherboards have several expansion slots for plugging in the control cards (adapters...

Claims

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Application Information

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IPC IPC(8): G01R31/28G01R1/04G01R1/067
CPCG01R31/282G01R31/2808G01R1/0416G01R1/06716
Inventor 袁卫成
Owner 深圳市众博信发展有限公司
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