Die attach adhesive applied to anti-electromigration lamp bead and anti-electromigration lamp bead
A technology of solid crystal glue and lamp beads, which is applied in the direction of electric solid devices, circuits, electrical components, etc., can solve problems such as electromigration, achieve the effect of preventing short circuit and improving metal migration phenomenon
Pending Publication Date: 2021-12-17
吉安市木林森显示器件有限公司
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Problems solved by technology
[0004] The purpose of the present invention is to provide a crystal-fixing glue and an anti-electromigration lamp bead applied to an anti-electromigration lamp bead, so as to solve the problem of electromigration caused by the direct contact between the bottom of the wafer and the metal functional area of the lamp bead bracket in the prior art
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[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0023] Please refer to the attached image 3 To attach Figure 4 , the present embodiment provides an anti-electromigration lamp bead, including a lamp bead holder 1, a chip 2, and a crystal-bonding glue 3 applied to an anti-electromigration lamp bead for connecting the chip 2 to the lamp bead holder 1. The above-mentioned crystal-bonding glue 3 applied to anti-electromigration lamp beads includes a crystal-bonding glue matrix 31 and particle fill...
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Abstract
The invention relates to the technical field of die attach adhesives, in particular to a die attach adhesive applied to an anti-electromigration lamp bead, which comprises a die attach adhesive matrix and particle fillers distributed in the die attach adhesive matrix. The die attach adhesive is used for filling the gap between a wafer and a lamp bead support to form a heightening layer so as to prevent the bottom of the wafer from making direct contact with a metal functional area of the lamp bead support. The invention further discloses an anti-electromigration lamp bead which comprises a lamp bead support, a wafer, and the die attach adhesive applied to the anti-electromigration lamp bead for connecting the wafer to the lamp bead support. According to the die attach adhesive applied to the anti-electromigration lamp bead and the anti-electromigration lamp bead provided by the invention, the particle filler is added into the die attach adhesive matrix, so that the wafer is raised after being mounted on the lamp bead support and die-bonded, the bottom of the wafer is prevented from being in direct contact with the metal functional area of the lamp bead support, and abnormality such as short circuit caused by migration of metal elements between the metal functional area in the lamp bead support and a wafer electrode along the side surface and the bottom of the wafer is effectively prevented.
Description
【Technical field】 [0001] The invention relates to the technical field of crystal-bonding glue, in particular to a crystal-bonding glue applied to an anti-electromigration lamp bead and an anti-electromigration lamp bead. 【Background technique】 [0002] As people's requirements for high-definition display screens are getting higher and higher, small-pitch display screen products are developing rapidly, and the pitches are getting smaller and smaller. However, there are generally quality problems such as electromigration in small-pitch products. The phenomenon of electromigration, on the one hand, is manifested in the metal migration between the product wafer electrodes; on the other hand, it is mainly manifested in the metal migration between the metal functional areas inside the LED lamp bead bracket, and between the metal functional areas of the bracket and the wafer electrodes. The invention is mainly devoted to improving the metal migration between the metal functional a...
Claims
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IPC IPC(8): H01L25/075H01L33/54H01L33/56H01L33/62
CPCH01L25/0753H01L33/54H01L33/62H01L33/56
Inventor 刘法湧曹锋刘勇华李远鹏李秦豫张盛
Owner 吉安市木林森显示器件有限公司