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Packaging module, preparation method thereof, board-to-board connection structure, preparation method of board-to-board connection structure, and terminal

A connection structure, board-to-board technology, applied in the structural connection of printed circuits, printed circuit manufacturing, and assembling printed circuits with electrical components, which can solve problems such as large total thickness

Active Publication Date: 2021-12-28
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, as electronic products are becoming more and more thinner and shorter, the connection between the existing circuit boards needs to consider the problem of excessive total thickness

Method used

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  • Packaging module, preparation method thereof, board-to-board connection structure, preparation method of board-to-board connection structure, and terminal
  • Packaging module, preparation method thereof, board-to-board connection structure, preparation method of board-to-board connection structure, and terminal
  • Packaging module, preparation method thereof, board-to-board connection structure, preparation method of board-to-board connection structure, and terminal

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Embodiment Construction

[0087] Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application.

[0088] Such as figure 1 As shown, a board-to-board connection structure 100 is shown. The board-to-board connection structure 100 may be disposed in a housing of a terminal. The terminal can be an electronic device such as a mobile phone, a notebook computer, or a tablet computer.

[0089] see figure 1 , see also image 3 , the board-to-board connection structure 100 includes a packaging module 10 and a first functional module 40 electrically connected to the packaging module 10 . The package module 10 includes a package base 1a, the package base 1a may be a System In a Package (SIP) module, or a Package on Package (POP) module, in this embodiment , the packaging base 1a is a SIP module. The first functional module 40 may be a printed circuit board (Printed Circuit Board, PCB), or a flexible circuit board (Flexible Printed Circ...

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Abstract

The invention provides a packaging module. The packaging module comprises a packaging substrate, an electric connection layer and connection pads, and the packaging substrate comprises a substrate, a first circuit layer, an electronic component electrically connected with the first circuit layer, and a first packaging layer which is located on the substrate and packages the electronic component and the first circuit layer; the electric connection layer is arranged on the surface of the first packaging layer and is electrically connected with the first circuit layer; and the connecting pads are arranged on the surface, away from the first packaging layer, of the electric connecting layer, and the connecting pads are electrically connected with the electric connecting layer. The invention also provides a board-to-board connection structure and a terminal using the packaging module, and preparation methods of the packaging module and the board-to-board connection structure. The electrical connection layer and the connection pads are arranged on the surface of the packaging substrate, so that the thickness of the packaging module can be greatly reduced, and a board-to-board connection structure and a terminal can be light, thin, short and small.

Description

technical field [0001] The present application relates to a packaging module capable of reducing the total thickness, a preparation method of the packaging module, a board-to-board connection structure using the packaging module, a preparation method and a terminal. Background technique [0002] With the wide application of circuit boards in the electronic field, in order to exert the multi-functions of electronic products, it is usually necessary to integrate two or more circuit boards with different functions through connection. [0003] However, as electronic products become more and more thinner and shorter, the connection between existing circuit boards needs to consider the problem of excessive overall thickness. Contents of the invention [0004] The first aspect of the embodiment of the present application provides a packaging module, the packaging module includes a packaging base, an electrical connection layer and a connection pad, the packaging base includes a s...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/14H05K1/18H05K3/30H05K3/36
CPCH05K1/0296H05K1/185H05K3/303H05K3/368H05K1/144
Inventor 刘鹏盛明李梦园
Owner HUAWEI TECH CO LTD
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