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Distributed semiconductor refrigeration air conditioning garment

A semiconductor and air-conditioning clothing technology, applied in clothing, clothing, protective clothing, etc., can solve the problems of human discomfort, small cross-sectional area of ​​refrigeration devices, evaporation, etc., to achieve easy portability and wear, good cooling effect, and solve the effect of insufficient heat dissipation.

Pending Publication Date: 2021-12-31
湖北赛格瑞新能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The air-conditioning clothing adopts the fan-cooled structure, such as the patent application number of "human body cooling air-conditioning clothing driven by micro / nano fan array" announced in 2007. The overall volume of each micro fan used in it is 1mm 3 to 1cm 3 Between the range, 1 to 1000 miniature fans are connected in parallel with an external micro power supply through the circuit connection woven in the clothing; the fan is driven by the power supply to complete the enhanced convection and evaporation heat dissipation on the human body surface, realizing Adjust the local temperature of almost all parts of the human body; the essence of this technology is to use micro / nano fans to provide flowing air for the human body. The disadvantage is that due to the small size of the fan, a single fan cannot meet the demand for enhanced heat dissipation, and a large number of fans are required to form an array to blow air into the clothes. Due to the large number of components such as micro / nano fans and micro / nano power supplies, most of them are The moving parts are expensive, the circuit complexity is high, and the various postures and shapes of the human body during the movement will cause various deformations of the clothing, which will significantly increase the risk of product failure. At the same time, if the outdoor sports conditions involving sand and water also restrict the use of the product
The disadvantage of this technology is that the circulating water inside the garment will gradually evaporate or leak over time, making the product ineffective
At the same time, various movement postures of the human body will inevitably bend and twist the capillary, resulting in blockage and temporary failure of the product
The circulating water inside the garment and its pipeline also make it difficult to disassemble and wash the garment, while significantly increasing the weight of the garment
[0006] There are also some products that disclose that the semiconductor refrigeration device directly contacts the human skin for cooling. The defect of this technology is that the semiconductor refrigeration device has a small cross-sectional area and can only cool a small area of ​​skin. At this time, the cooling capacity generated by the device is too concentrated. Causes excessive cooling of this part of the skin causing discomfort to the human body, while the skin not covered by the device remains hot
In addition, the concentrated cooling capacity of the device will also lead to the appearance of condensed water, which will soak the clothing and cause more trouble

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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  • Distributed semiconductor refrigeration air conditioning garment
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  • Distributed semiconductor refrigeration air conditioning garment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1: The present invention provides a distributed semiconductor refrigeration and air-conditioning clothing, the structure of which is as follows: figure 1 , 2 As shown, it includes the main body of the air-conditioning suit 1, the silicone soft plate 2, the semiconductor refrigeration device 3, the lead wire 4, the mobile power supply 6, the fan 8 and the belt 5; the back of the air-conditioning suit main body is provided with a supporting piece for the silicone soft plate. 7, asfigure 1 As shown, the fixing part of this embodiment is a clip, one side of the silicone soft board is fastened to the back of the main body of the air-conditioning suit through the clip, and the other side of the silicone soft board is pasted with several groups of small and low-power semiconductor refrigeration devices 3 An array of semiconductor refrigeration devices is formed, and the array of semiconductor refrigeration devices is electrically connected to the mobile power supply...

Embodiment 2

[0035] Embodiment 2: The present invention provides a kind of distributed semiconductor refrigeration air-conditioning clothing. The structure of the air-conditioning clothing in this embodiment is basically the same as that in Embodiment 1. The difference is that the mobile power source described in this embodiment is polymer lithium integrated with a switch. battery; the fixing part is a slide fastener; image 3 shown. The fin radiator 9 is used to improve the heat dissipation capacity of the semiconductor refrigeration device 3, and the added fin radiator will not significantly increase the weight and volume of the air-conditioning suit, but it can improve the cooling efficiency of the semiconductor refrigeration device 3, so that the human body can obtain Lower temperature experience.

Embodiment 3

[0036] Embodiment 3: The present invention provides a kind of distributed semi-conductor refrigeration air-conditioning service, is the simplified semi-conductor refrigeration air-conditioning service, such as Figure 4 As shown, the structure of the air-conditioning clothing of this embodiment is basically the same as that of Embodiment 2, except that the main body of the air-conditioning clothing is a tool with long sleeves and a stand-up collar, and since the semiconductor refrigeration device 3 used is provided with a small fin radiator 9, The cooling efficiency of the semiconductor refrigeration device is improved. At the same time, the low-power semiconductor refrigeration device itself has a small calorific value, and can operate efficiently under the environmental conditions without fan auxiliary heat dissipation. Therefore, the fan 8 and the gas distribution belt 10 are not provided in this embodiment. The refrigerating and air-conditioning clothing of this embodiment ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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PUM

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Abstract

The invention relates to a distributed semiconductor refrigeration air conditioning garment which comprises an air conditioning garment body, a silica gel soft plate, a semiconductor refrigeration device, a wire, a mobile power source, a fan, a waist belt and an air distribution belt. The silica gel soft plate is fixed to the outer side of the back of the air conditioning garment body, the semiconductor refrigeration device array composed of low-power semiconductor refrigeration devices is attached to the other side face of the silica gel soft plate, and the array, the fan and the mobile power source are electrically connected through wires. The waist belt is arranged on the waist of the air conditioning garment body, the mobile power source, the fan and the air distribution belt are fixed to the waist belt, an air outlet of the fan is connected with one end of the air distribution belt, air generated by the fan is vertically blown to the array through air distribution holes of the air distribution belt, the temperature of the hot end of the semiconductor refrigeration device is reduced, the refrigeration performance is enhanced, and the semiconductor refrigeration device directly cools the silica gel soft plate to bring ice-cool experience to the human body. The air conditioning garment is simple in structure, good in heat dissipation and cooling effect and comfortable to wear, and the air conditioning garment body is easily separated from the silica gel soft plate and the waist belt and convenient to clean.

Description

technical field [0001] The invention relates to refrigeration and air-conditioning clothing, in particular to a distributed semiconductor refrigeration and air-conditioning clothing. Background technique [0002] At present, there are many types of air-conditioning clothing on the market, including fan air-cooled, water-cooled, and semiconductor refrigeration devices. Soldiers, construction metallurgists, electric welders, special medical groups, etc. provide work clothes with functions of cooling and cooling the human body. [0003] The air-conditioning clothing adopts a fan air-cooled structure, such as the patent application number 200510102700.2 announced in 2007 for "Human Body Cooling Air-conditioning Clothing Driven by Micro / Nano Fan Array", and the overall volume of each micro-miniature fan used is 1mm. 3 to 1cm 3 Between the range, 1 to 1000 miniature fans are connected in parallel with an external micro power supply through the circuit connection woven in the clo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A41D13/005
CPCA41D13/0053
Inventor 王宇冲陈卓廖明建许春华樊希安
Owner 湖北赛格瑞新能源科技有限公司
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