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Camera module baking monitoring system and method

A technology of camera module and monitoring system, which is applied in the testing of machines/structural components, measuring devices, image communication, etc. It can solve problems such as incorrect baking temperature, affecting test results, and inaccurate baking time, and achieves the goal of solving the problem of baking The effect of not roasting at a constant temperature

Pending Publication Date: 2021-12-31
江西盛泰精密光学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is inevitable that there will be problems such as inaccurate baking time, incorrect baking temperature, and the camera module to be tested being taken out in advance.
These problems will cause the test results after baking to be affected due to improper baking conditions, thereby bringing risks

Method used

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  • Camera module baking monitoring system and method
  • Camera module baking monitoring system and method
  • Camera module baking monitoring system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] like figure 1 As shown, a monitoring method for camera module baking includes the following contents:

[0050] Preparation steps: place the camera module to be baked in the baking module tray, and put it into the baking incubator, set the baking conditions, and the baking conditions include the internal temperature of the baking incubator and the baking time; In this embodiment, settings are made according to actual conditions, for example, the internal ambient temperature is 40-80° C., and the baking time is 30-240 minutes.

[0051] Parameter setting steps: The monitoring equipment is located directly above the inside of the oven incubator, turn on the lighting source and adjust the appropriate lighting brightness; set the appropriate exposure value of the monitoring camera through the control host. The lighting brightness and exposure value can be adjusted according to the actual situation to ensure that the monitoring camera can obtain a clear image.

[0052]Set th...

Embodiment 2

[0074] Based on the monitoring method for camera module baking, this embodiment also provides a monitoring system for camera module baking, such as image 3 As shown, it includes a baking incubator, a module tray to be baked for placing the camera module, and also includes monitoring equipment and a control host;

[0075] The inside of the baking incubator is used to place the module tray to be baked, and the baking incubator can set the baking temperature and baking time.

[0076] In this embodiment, the monitoring device adopts an integrated monitoring device, which is placed directly above the inside of the oven incubator, and includes a temperature sensor, an illumination light source and a monitoring camera. The temperature sensor is used to collect the current temperature; the illumination light source is used to provide illumination for the internal environment of the baking incubator; the monitoring camera is used to collect images inside the baking incubator.

[0077...

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Abstract

The invention relates to the technical field of product detection, and particularly discloses a camera module baking monitoring system and a method. The method comprises the following steps: a parameter setting step: setting baking monitoring time and a monitoring cycle period; an image monitoring step: collecting a current image of baking according to a monitoring cycle period within a set baking monitoring time, dividing the current image into a plurality of view fields and calculating MTF values, and circularly comparing whether the MTF values of the view fields in the image meet a preset condition within the baking monitoring time or not; if the preset condition is not met, the image is obtained again, the MTF value is calculated and compared, and if the preset condition is still not met, baking is stopped. According to the technical scheme, the baking process of the camera module can be automatically and effectively monitored.

Description

technical field [0001] The invention relates to the technical field of product detection, in particular to a monitoring system and method for baking a camera module. Background technique [0002] Camera modules are widely used in mobile phones, tablets, notebooks, security, automotive, medical, monitoring and other fields. Due to the wide application fields and various usage conditions, camera modules may encounter high temperature environments. In order for the camera module to work normally at high temperature, the camera module manufacturer needs to perform a baking experiment on the camera module before shipment. By comparing the lens field curvature before and after baking to analyze the changes in the resolution force of the camera module after high temperature, the module glue falls off or the glue is resistant to high temperature. [0003] Most of the current camera module manufacturers complete the baking setting conditions through manual operation. After the bakin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N17/00G01M11/00
CPCH04N17/002G01M11/00
Inventor 胡露肖仁涛姚翠林映庭宋凯静
Owner 江西盛泰精密光学有限公司
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