Self-adaptive heat storage high-heat-conductivity module locking device

A locking device, high thermal conductivity technology, applied in the direction of circuit heating device, modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., to achieve the effect of comprehensive functions, reasonable structural design, and guaranteed locking function

Pending Publication Date: 2021-12-31
XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing locking bar structure is difficult to meet the application requirements

Method used

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  • Self-adaptive heat storage high-heat-conductivity module locking device
  • Self-adaptive heat storage high-heat-conductivity module locking device
  • Self-adaptive heat storage high-heat-conductivity module locking device

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Embodiment Construction

[0026] Embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings.

[0027] Embodiments of the present disclosure are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Apparently, the described embodiments are only some of the embodiments of the present disclosure, not all of them. The present disclosure can also be implemented or applied through different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in the present disclosure, a...

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PUM

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Abstract

The invention provides a self-adaptive heat storage high-heat-conductivity module locking device which comprises a locking strip and a pressure rod, the locking strip comprises a wedge block A, a wedge block B and a wedge block C which are connected in sequence, and the two opposite side walls of the wedge block A, the wedge block B and the wedge block C are each provided with a groove which is provided with two through ends and used for installing the pressure rod; the wedge-shaped block A, the wedge-shaped block B and the wedge-shaped block C are each internally provided with a temperature control deformation cavity, and the temperature control deformation cavities are filled with phase change materials. On the basis of meeting the mounting function of the locking module, the application requirements of short-time high heat shock and high heat-conducting property in the electronic equipment can be adaptively processed.

Description

technical field [0001] The disclosure relates to heat dissipation structure technology of electronic equipment, in particular to an adaptive heat storage and high thermal conductivity module locking device. Background technique [0002] With the development of electronic equipment towards high performance and high integration, the heat transfer efficiency of its structure will directly affect the temperature rise of the components in the electronic equipment, which in turn determines the life and reliability of the electronic equipment. [0003] At present, most of the modules in electronic equipment are installed in the form of field replaceable modules (LRM). The typical heat transfer path is components>printed board / module cold plate>rail>chassis>ambient air. In the printed board / module cold plate > guide rail, this link is the bottleneck of heat transfer in electronic equipment. In the link of printed board / module cold plate > guide rail, the locking b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K7/20
CPCH05K1/0203H05K7/2039
Inventor 董进喜赵亮杨明明吴波周尧赵航
Owner XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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