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Shell and electronic equipment

A shell and body technology, which is applied in the structural parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., can solve the problems of poor heat dissipation performance of the shell, improve the strength, improve the heat dissipation efficiency, and reduce the surface area degree of effect

Active Publication Date: 2021-12-31
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present application provides a casing to solve the technical problem of poor heat dissipation performance of the casing in the prior art

Method used

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  • Shell and electronic equipment
  • Shell and electronic equipment
  • Shell and electronic equipment

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Experimental program
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Embodiment Construction

[0033] Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application.

[0034] see figure 1 , figure 1 is a schematic structural diagram of the electronic device 200 provided in this application.

[0035] The electronic device 200 includes, but is not limited to, a cell phone, a notebook computer, a tablet personal computer, a laptop computer, a personal digital assistant, or a wearable device ( wearable device) etc. Hereinafter, the electronic device 200 is described as a mobile phone.

[0036] The electronic device 200 includes a body 110 and a casing 100 , and the casing 100 is installed on the body 110 . The casing 100 is a battery cover of the electronic device 200 . The structure of the housing 100 will be described in detail below.

[0037]For ease of description, in this application, the width direction of the casing 100 is defined as the X direction, the length direction is defined as the ...

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Abstract

The invention provides a shell and electronic equipment. The shell comprises a first supporting plate, a second supporting plate and a vapor chamber. The first supporting plate, the vapor chamber and the second supporting plate are arranged in a stacked mode, and the vapor chamber is located between the first supporting plate and the second supporting plate and connected with the first supporting plate and the second supporting plate. A heat dissipation channel is arranged in the vapor chamber, the heat dissipation channel comprises a main heat dissipation channel and an auxiliary heat dissipation channel, the main heat dissipation channel is communicated with the auxiliary heat dissipation channel, and heat exchange can be carried out between the main heat dissipation channel and the auxiliary heat dissipation channel. According to the shell provided by the invention, the technical problem of poor heat dissipation performance of a shell in the prior art is solved.

Description

technical field [0001] The present application relates to the technical field of electronic products, in particular to a casing and electronic equipment. Background technique [0002] With the development of science and technology, electronic devices (such as mobile phones, tablet computers, etc.) are gradually becoming thinner and lighter. The back cover made of plastic is conducive to the thinning of electronic equipment, and the thermal conductivity of plastic is poor, resulting in poor heat dissipation performance of electronic equipment and affecting the performance of the whole machine. Contents of the invention [0003] The present application provides a casing to solve the technical problem of poor heat dissipation performance of the casing in the prior art. [0004] In a first aspect, the present application provides a casing. The casing includes: a first support plate, a second support plate and a heat soaking plate. The first support plate, the heat soaking p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336G06F1/1626G06F1/1656G06F1/203H01L23/427H01L23/373H01L23/3736Y02E60/10
Inventor 万伟舰罗永清陈金玉
Owner HONOR DEVICE CO LTD
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