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Ejector pin mechanism horizontal adjusting device

A level adjustment device and thimble technology, which is applied in the direction of gaseous chemical plating, coating, electrical components, etc., can solve the problems of high processing precision and difficulty in adjusting the level of thimble, so as to meet the requirements of reducing processing accuracy and maintain stability Effect

Active Publication Date: 2022-01-07
BETONE TECH SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a horizontal adjustment device for the thimble mechanism, which is used to solve the problem that the thimble mechanism in the prior art requires high processing precision of the equipment and it is difficult to adjust the level of the plane where the thimble is located during installation. degree of question

Method used

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  • Ejector pin mechanism horizontal adjusting device
  • Ejector pin mechanism horizontal adjusting device
  • Ejector pin mechanism horizontal adjusting device

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Embodiment Construction

[0034] The embodiments of the present invention will be described below by specific embodiments, and those skilled in this specification can easily understand other advantages and efficacy of the present invention.

[0035] See Figures 2 to 6 . It should be noted that the structure, proportion, size, etc., which are drawn in the accompanying drawings of this specification, are only used in conjunction with the description, and those who are familiar with this technique are not intended to limit the implementation of the present invention. The conditions are limited, so that there is no technical substantive significance, the modification of any structure, the change or size of the proportional relationship or the size of the proportional relationship, without affecting the efficacy of the present invention, is still falling in the present invention. The disclosed technical content can be covered. At the same time, the use of "upper", "" "," left "," right "," middle "," "", ",", "...

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PUM

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Abstract

The invention provides an ejector pin mechanism horizontal adjusting device which comprises a plurality of ejector pin mechanisms and a plurality of ejector pin adjusting assemblies, wherein each ejector pin mechanism comprises an ejector pin and a jacking structure; the ejector pin adjusting assembly comprises a vertical displacement adjusting unit and an angle adjusting unit, the vertical displacement adjusting unit is connected with a fixing part of the jacking structure through a connecting piece, and adjustment of the vertex of an ejector pin in the height direction is achieved; and the upper end of the angle adjusting unit is fixedly connected with the cavity, and the lower end is fixedly connected with the vertical displacement adjusting unit for adjusting the angle between the ejector pin and the bottom surface of the cavity. According to the device, the ejector pin mechanism can be conveniently installed, the levelness is adjustable, and during installation, the angle between the ejector pins and the bottom surface of the cavity can be rapidly adjusted, so that the plane where the vertexes of the multiple ejector pins are located is enabled to be in a horizontal state; and after the cavity is adjusted to be horizontal, by adjusting the angle between the support and the bottom surface of the cavity, deviation of the vertex of the ejector pin in levelness caused by low machining precision or assembly errors of all equipment can be compensated, and the requirement for the machining precision of the equipment is lowered.

Description

Technical field [0001] The present invention belongs to the technical field of semiconductor equipment, and more particularly to a top needle mechanism horizontal adjustment device. Background technique [0002] In the semiconductor manufacturing process, especially in the field of vacuum coating, the wafer is typically transmitted between the various chambers in the field, and in order to meet the needs of the robot, the needle mechanism is usually used in various chambers. Unexpellent mechanism in the prior art figure 1 As shown, the thimble mechanism is connected to the cavity 102, and the thimble mechanism includes three thimbles 101, and the three thimble 101 are uniformly distributed on the base 103, and the base 103 is disposed vertically, the base 103 is disposed in the bottom of the cavity 102. The bottom portion of the base 103 is provided with a top rising structure, and the top rising structure includes moving end 104 and the fixed end 105, and the movable end 104 can...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687C23C16/458C23C16/52
CPCH01L21/68742C23C16/4581C23C16/52
Inventor 刘祥宋维聪睢智峰封拥军郑倪明张晓王晓炎崔世甲
Owner BETONE TECH SHANGHAI
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