Single board, computing device and manufacturing method

A manufacturing method and veneer technology, which can be used in semiconductor/solid-state device manufacturing, cooling/ventilation/heating transformation, printed circuits connected with non-printed electrical components, etc., and can solve problems such as chip device crushing

Pending Publication Date: 2022-01-07
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to improve the heat dissipation effect, the heat sink is placed on the chip device o

Method used

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  • Single board, computing device and manufacturing method
  • Single board, computing device and manufacturing method
  • Single board, computing device and manufacturing method

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Experimental program
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Embodiment Construction

[0057] The embodiment of the present application relates to a single board, which may be a main control board, a service board, or an interface board of a computing device, such as figure 1 As shown, the single board includes a chip 1 and a circuit board 3, wherein: the chip 1 includes a chip device 11 and a chip substrate 12, the chip device 11 is located on the chip substrate 12, and the chip substrate 12 is located on the circuit board 3; There is a supporting member 4 around the chip device 11 , the first end of the supporting member 4 is used to attach to the heat sink 2 , and the second end of the supporting member 4 is attached to the chip substrate 12 .

[0058] In some embodiments, the single board may not include the radiator 2 , or may include the radiator 2 . For example, when manufacturing a single board, the heat sink 2 may be integrated on the single board, for example, the heat sink 2 is placed on the support member 4 and the chip device 11 . For another examp...

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PUM

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Abstract

The embodiment of the invention discloses a single board, computing equipment and a manufacturing method, and belongs to the technical field of chips. The single board comprises a chip, a radiator and a circuit board; the chip comprises a chip device and a chip substrate; the chip device is located on the chip substrate, the chip substrate is located on the circuit board, and the radiator is located on the chip device; a supporting piece is arranged between the chip substrate and the radiator and located on the periphery of the chip device, the first end of the supporting piece is attached to the radiator, and the second end of the supporting piece is attached to the chip substrate. By adopting the scheme of the embodiment of the invention, most or even all of the weight of the radiator is pressed on the supporting piece, so that a higher pressure applied to the chip device by the radiator can be reduced or even avoided, the chip device is protected, and the condition that the chip device is crushed by the radiator can be avoided.

Description

[0001] This application claims the priority of the Chinese patent application with the application number 202010641771.4 and the title of the invention "Packaging Device, Related Equipment and Manufacturing Method" filed on July 6, 2020, the entire contents of which are incorporated in this application by reference. technical field [0002] The present application relates to the field of chip technology, in particular to a single board, computing equipment and a manufacturing method. Background technique [0003] The chip of the computing device generates more heat during operation. In order to dissipate heat for the chip of the computing device, a radiator is usually installed on the chip, and the chip dissipates heat through the radiator. [0004] In order to improve the heat dissipation effect, the heat sink is placed on the chip device of the chip and is in contact with the chip device, but the heat sink is easy to crush the chip device. Contents of the invention [00...

Claims

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Application Information

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IPC IPC(8): H05K1/18H05K3/30H05K7/20H01L21/52H01L23/12H01L23/16H01L23/367
CPCH05K1/181H05K3/30H05K7/2039H01L23/3672H01L23/12H01L23/16H01L21/52H05K1/18H05K7/20H01L23/367
Inventor 王辉叶继龙郭志刚杨书玉
Owner HUAWEI TECH CO LTD
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