Liquid supply system and liquid supply method

Abstract

The embodiment of the invention provides a liquid supply system and method. The liquid supply system comprises: a mixing tank, which is at least connected with a first injection pipeline, a second injection pipeline, and a supplement pipeline, wherein the first injection pipeline and the second injection pipeline are respectively used for injecting a first liquid and a second liquid into the mixing tank to form a mixed liquid; a parameter acquisition module, wherein the parameter acquisition module is used for acquiring the concentration of the first liquid in the mixed liquid; and a processing module, wherein the processing module is used for controlling the supplementing pipeline to inject the first liquid with the first flow into the mixing tank or inject the second liquid with the second flow into the mixing tank based on the obtained concentration of the first liquid and the preset concentration of the first liquid, so that the concentration of the first liquid in the mixed liquid is close to the preset concentration of the first liquid. The supply quantity of the first liquid and the second liquid is stabilized through the additionally arranged supplementing pipeline, so that the stability of the concentration of the first liquid in the formed mixed solution is relatively high.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a liquid supply system and a liquid supply method. Background technique [0002] At present, the etching material used in the single-chip wet cleaning and etching machine is mainly diluted hydrofluoric acid (DHF), and the single-chip wet cleaning and etching machine will use DHF for a long time in the process, so the concentration of DHF fluctuates It will seriously affect the etching amount of the wafer, thus directly affecting the yield of the product. [0003] With the progress of the semiconductor process, the line width is getting smaller and smaller, and the stability of the concentration of DHF required by the single-chip wet cleaning and etching machine is getting higher and higher. The DHF required by the single-chip wet cleaning etching machine comes from the mixture of 49% hydrofluoric acid (49% HF) and deionized water (DIW). [0004] However, the inventors found that i...

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Problems solved by technology

[0004] However, the inventor found that in the prior art, due to pressure fluctuations in the main system of the factory service end, it is difficult to stabilize the supply of 49% HF and DIW, resulting in large fluctuations in the concentration of DHF formed by mixing, thereby affecting the quality of the product. Rate

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