A method to improve MWT hole concealment
A technology of aluminum back field and mesh, which is applied in the direction of sustainable manufacturing/processing, climate sustainability, semiconductor devices, etc., can solve the problems of broken silicon wafers, large force at the raised negative pole, and hidden battery holes. Cracks and other problems to achieve the effect of reducing hidden cracks and reducing stress
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Embodiment 1
[0029] The present embodiment is a method for improving MWT hole concealment, and the method includes the following steps:
[0030] S1, printing the plugging paste of the MWT cell to form a negative electrode point on the cell;
[0031] S2, printing the back silver paste to form a positive point;
[0032] S3, making a stencil for printing the aluminum back field, the stencil includes a mesh layer, the thickness of the emulsion corresponding to the negative point position is greater than that of other parts of the aluminum back field, and the corresponding negative point position is coated with a 12-25um film thickness emulsion; Printed aluminum back field;
[0033] S4, flip the MWT cell sheet, and print the front grid lines.
Embodiment 2
[0035] As a preferred embodiment of the application, in the S3, a screen plate with an emulsion thickness of 25um is used at the position of the negative electrode point hole.
[0036] The structure of the current printed aluminum back field stencil is as follows figure 2 As shown in the figure, the number marked in the figure is the aperture data, the middle area of the screen is the mesh, and the corresponding structures of the positive electrode point and the negative electrode point are preset in the mesh, wherein the aperture of the negative electrode point is 5mm, and the aperture of the positive electrode point is 2.7 mm. mm, the distance between the positive electrode points is 27mm, and the structure of the mesh is as follows Figure 5 As shown, the electrode point position is coated with a layer of emulsion with a thickness of 12um film on the mesh (a common material for stencil production, a kind of photosensitive glue, when making the stencil, according to the r...
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