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Packaging method of LED device with matte surface

A technology of LED devices and packaging methods, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of material and process parameter limitations, and achieve a stable matte effect

Pending Publication Date: 2022-01-11
汇涌进光电(浙江)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The above solutions have high requirements on the type, addition amount, resin viscosity, and curing process of inorganic fillers. In actual operation, the selection of materials and process parameters is greatly restricted.

Method used

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  • Packaging method of LED device with matte surface

Examples

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Embodiment 1

[0024] This embodiment provides a matte-surfaced LED lamp bead, which includes the following parts: LED bracket 4, LED light-emitting chip 2, wire 3 connecting LED light-emitting chip 2 and LED bracket 4, and colloid 5 covering the inside of the bowl , there are multiple silica micropowder particles 1 inside and on the surface of the colloid. In other embodiments, it can also be an LED flip-chip, so that there is no wire 3 .

[0025] In this implementation, silica powder 1 can be a solid spherical or irregular shape, deposited on the surface of the colloid in the figure, and dispersed in the interior of the colloid, its D 50 5-20μm, density 2-2.65kg / L. The colloidal surface has a surface roughness of 1-20 μm due to the action of silica micropowder.

[0026] The matte surface LED lamp bead of this embodiment, its encapsulation method comprises the following several steps:

[0027] (1) Assembling: bonding the LED light-emitting chip 2 to the support pad 6 with glue, and then ...

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Abstract

The invention discloses a packaging method of an LED device with a matte surface. The method comprises the steps: assembly, glue preparation, glue dispensing and curing. During glue preparation, silicon dioxide micro powder is added into a glue body; and during curing, the bowl cup surface of the bracket is downwards heated, and the viscosity of the colloid is reduced due to heating, wherein the silicon dioxide micro powder is gradually deposited on the surface of the colloid under the action of gravity, and after the colloid is cured, the silicon dioxide micro powder is fixed on the surface of the colloid to form a matte effect. According to the packaging method of the LED device with the matt surface, a stable matt effect can be formed on the surface of the packaging colloid of the LED device only by adding a certain amount of silicon dioxide micro powder into the colloid and carrying out inverted baking on the LED device during curing. Compared with the prior art, the method disclosed by the invention has the advantages that the existing matte process is remarkably simplified, and the requirements on the type, the addition amount, the resin viscosity, the curing process and the like of the inorganic filler are not required.

Description

technical field [0001] The invention relates to the technical field of LED device packaging, in particular to a method for packaging a matte surface LED device. Background technique [0002] Traditional LED devices have flat colloidal surfaces and small roughness. When they are made into LED displays, it is easy to cause reflections on the entire display surface and affect the light output effect of the entire LED display. On the other hand, the colloidal surfaces of LED devices are flat. , easy to form glare phenomenon. The solution is to create a matte effect on the surface of the semiconductor device, which is conducive to the diffuse reflection of light and improves the visual perception. This demand is particularly notable in the field of displays. [0003] At present, the method for producing a matte effect on the surface of a semiconductor device is: during the LED packaging process, inorganic silica microspheres will be added to the encapsulating colloid in the bow...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/52H01L33/56H01L33/48H01L33/62
CPCH01L33/52H01L33/56H01L33/48H01L33/62
Inventor 金峥邵铁枫
Owner 汇涌进光电(浙江)有限公司
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