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Ultraviolet response peelable pressure-sensitive adhesive based on natural peach gum and preparation method thereof

An ultraviolet light and pressure-sensitive adhesive technology, applied in the field of pressure-sensitive adhesives, can solve the problems of not meeting the development requirements of protecting the environment and carbon emissions, and achieve the effect of reducing the use of petrochemical-based raw materials, easy peeling, and reducing carbon emissions

Active Publication Date: 2022-01-14
HUBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, all the raw materials used in the existing UV-responsive peelable pressure-sensitive adhesives are petrochemical-based raw materials, which do not meet the development requirements of protecting the environment and reducing carbon emissions.

Method used

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  • Ultraviolet response peelable pressure-sensitive adhesive based on natural peach gum and preparation method thereof
  • Ultraviolet response peelable pressure-sensitive adhesive based on natural peach gum and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The first step, lithium chloride (2.91g) is dissolved in N, N-dimethylacetamide (26.15g), obtains the LiCl / DMAc solution of 10wt%, under the condition of stirring, adds 10.57g natural peach gum , the temperature was raised to 120°C, and the stirring was continued for 7 hours to obtain a viscous solution, which was filtered to remove impurities to obtain a peach gum solution.

[0036] In the second step, the concentration of 30% hydrogen peroxide aqueous solution (7.04g) was added to the peach gum solution obtained in the first step, mixed evenly, at room temperature, under the condition of stirring, the power used was 1500mW / cm 2 A UV point light source (wavelength 365nm) irradiated the solution for 25min to obtain the degraded peach gum solution.

[0037] In the third step, natural rosin (29.17g) is dissolved in N, N-dimethylacetamide (29.17g), mixed with the degraded peach gum solution obtained in the second step, and the peach gum-based adhesive is obtained after sti...

Embodiment 2

[0042] The first step, lithium chloride (2.33g) is dissolved in N,N-dimethylacetamide (20.92g), obtains the LiCl / DMAc solution of 10wt%, under the condition of stirring, adds 8.45g natural peach gum , the temperature was raised to 125°C, and the stirring was continued for 6 hours to obtain a viscous solution, which was filtered to remove impurities to obtain a peach gum solution.

[0043] In the second step, the concentration of 30% hydrogen peroxide aqueous solution (5.63g) was added to the peach gum solution obtained in the first step, mixed evenly, at room temperature, under the condition of stirring, the power used was 1500mW / cm 2 A UV point light source (wavelength 365nm) irradiated the solution for 25min to obtain the degraded peach gum solution.

[0044] In the third step, natural rosin (23.33g) is dissolved in N,N-dimethylacetamide (23.33g), mixed with the degraded peach gum solution obtained in the second step, and stirred to obtain the peach gum-based adhesive ;

...

Embodiment 3

[0049] The first step, lithium chloride (1.94g) is dissolved in N,N-dimethylacetamide (17.43g), obtains the LiCl / DMAc solution of 10wt%, under the condition of stirring, adds 7.04g natural peach gum , the temperature was raised to 130°C, and the stirring was continued for 6 hours to obtain a viscous solution, which was filtered to remove impurities to obtain a peach gum solution.

[0050] In the second step, the concentration of 30% hydrogen peroxide aqueous solution (4.69g) was added to the peach gum solution obtained in the first step, mixed evenly, at room temperature, under the condition of stirring, the power used was 1500mW / cm 2 A UV point light source (wavelength 365nm) irradiated the solution for 35min to obtain the degraded peach gum solution.

[0051] In the third step, natural rosin (19.44g) is dissolved in N,N-dimethylacetamide (19.44g), mixed with the degraded peach gum solution obtained in the second step, and stirred to obtain the peach gum-based adhesive ;

...

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Abstract

The invention discloses an ultraviolet response peelable pressure-sensitive adhesive based on natural peach gum and a preparation method thereof. The ultraviolet response peelable pressure-sensitive adhesive is prepared from the following components in parts by weight: 6.04-10.57 parts of natural peach gum, 1.66-2.91 parts of lithium chloride, 31.61-55.32 parts of N, N-dimethylacetamide, 4.02-7.04 parts of a hydrogen peroxide aqueous solution with the concentration of 30%, 16.67-29.17 parts of natural rosin, 14.47-23.14 parts of polyether polyol, 27.57-34.54 parts of diisocyanate, 0.10-0.11 parts of a catalyst, 0.42 parts of a polymerization inhibitor, 25.80-41.44 parts of hydroxyl acrylate, 5.04 parts of a photoinitiator, and 4.32-5.67 parts of a defoaming agent. The pressure-sensitive adhesive is synthesized from natural peach gum and natural resin rosin, so that the use of petrochemical base raw materials in the current synthesis raw materials is reduced, and the pressure-sensitive adhesive is a new-generation environment-friendly and efficient functional high polymer material.

Description

technical field [0001] The invention belongs to the field of pressure-sensitive adhesives, and in particular relates to an ultraviolet light-responsive peelable pressure-sensitive adhesive based on natural peach gum and a preparation method thereof. Background technique [0002] Pressure-sensitive adhesives are a type of polymer materials that are applied to clean and dry surfaces and can adhere to various substrates under pressure. They are widely used in daily life and industrial production. [0003] In order to ensure the smooth progress of the dicing process in semiconductor manufacturing, UV light-responsive peelable pressure-sensitive adhesives are often used to secure silicon wafers. This pressure-sensitive adhesive has strong adhesion before ultraviolet light exposure, which can hold the silicon wafer tightly. After the cutting is completed, the pressure-sensitive adhesive loses its viscosity immediately under the action of UV curing, and the silicon wafer can be ea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J105/00C09J193/04
CPCC09J175/14C08L5/00C08L93/04
Inventor 郝同辉刘梓为张群朝蒋涛
Owner HUBEI UNIV
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