Immersed liquid cooling heat dissipation device

A liquid-cooled heat dissipation, immersion technology, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problem of air cooling being difficult to meet heat dissipation requirements, increase heat dissipation, etc., and achieve good heat dissipation effect. , High heat dissipation efficiency and compact layout

Pending Publication Date: 2022-01-14
CANAAN CREATIVE CO LTD
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

The use of a large number of computing chips will inevitably greatly increase the heat dissipation. Existing blockchain servers often use forced air cooling, but with the increase of heat dissipation density, air cooling is gradually difficult to meet the heat dissipation requirements. The liquid cooling heat dissipation method with higher heat dissipation efficiency is One of the options for the future

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  • Immersed liquid cooling heat dissipation device
  • Immersed liquid cooling heat dissipation device
  • Immersed liquid cooling heat dissipation device

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Embodiment Construction

[0050] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments to further understand the purpose, solution and effect of the present invention, but it is not intended to limit the scope of protection of the appended claims of the present invention.

[0051] References in the specification to "an embodiment", "another embodiment", "this embodiment" and the like mean that the described embodiment may include specific features, structures or characteristics, but not every embodiment must include These specific features, structures or characteristics. Furthermore, such expressions are not referring to the same embodiment. Further, when specific features, structures or characteristics are described in conjunction with an embodiment, whether or not there is an explicit description, it has been indicated that it is within the knowledge of those skilled in the art to combine such features,...

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Abstract

The invention discloses an immersed liquid cooling heat dissipation device which comprises a liquid cooling module and an oil way circulation device. The oil way circulation device comprises a cold oil outlet, a hot oil inlet and an oil cooling module, and the liquid cooling module comprises a liquid oil inlet connected with the cold oil outlet and a liquid oil outlet connected with the hot oil inlet. The liquid cooling module is arranged along an extension direction, and the plurality of computing devices to be cooled are sequentially immersed in the liquid cooling module along the extension direction. According to the immersed liquid cooling heat dissipation device, the multiple pieces of computing devices to be cooled are sequentially immersed in the liquid cooling module in the extending direction, the heat dissipation effect is good, and the heat dissipation efficiency is high.

Description

technical field [0001] The invention relates to the technical field of liquid cooling and heat dissipation, in particular to an immersion type liquid cooling and heat dissipation device. Background technique [0002] A computing device is an electronic device used for high-speed computing, such as a blockchain server used to run a specific algorithm and communicate with a remote server to obtain the corresponding virtual currency. The progress of existing industries has promoted the automation and intelligence of various computing devices to be cooled, including blockchain servers, and the optimization of computing device performance requires the support of more and more computing chips. The use of a large number of computing chips will inevitably greatly increase the heat dissipation. Existing blockchain servers often use forced air cooling, but with the increase in heat dissipation density, air cooling is gradually difficult to meet the heat dissipation requirements. The l...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20763
Inventor 朱燕斌张楠赓
Owner CANAAN CREATIVE CO LTD
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