Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package
A maleimide resin, maleimide technology, applied in printed circuits, printed circuits, printed circuit components, etc., can solve the problems of low compatibility and poor handling, and achieve low thermal expansion, good Effects of heat resistance, excellent dielectric properties
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[0314] Hereinafter, examples are given and the present invention will be described concretely. However, the present invention is not limited to the following examples.
[0315] In addition, in each example, the number average molecular weight was measured according to the following procedure.
[0316] (Measurement method of number average molecular weight)
[0317] The number average molecular weight was converted from a calibration curve using standard polystyrene by gel permeation chromatography (GPC). The standard curve uses standard polystyrene: TSKstandard POLYSTYRENE (Type; A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [Tosoh Corporation system, trade name], approximated by the cubic formula. The measurement conditions of GPC are shown below.
[0318] Device: High-speed GPC device HLC-8320GPC
[0319] Detector: Ultraviolet Absorption Detector UV-8320 [manufactured by Tosoh Corporation]
[0320] Column: guard column; TSK Guardcolumn SuperHZ-L+ column; TSKgel Supe...
manufacture example 1～5
[0331] In a glass flask container with a capacity of 2 L capable of heating and cooling equipped with a thermometer, a reflux condenser, and a stirring device, the (b1) component, (b2) component, reaction catalyst, and organic solvent in the amount shown in Table 1 were charged, and the Under the atmosphere, the mixture was reacted while stirring at 90 to 100° C. for 5 hours to obtain solutions of modified conjugated diene polymers B-1 to 5 (solid content concentration: 35% by mass). Table 1 shows the vinyl modification rate and number average molecular weight of the obtained modified conjugated diene polymer.
[0332] [Table 1]
[0333] Table 1
[0334]
[0335] In addition, the detail of each component described in Table 1 is as follows.
[0336] [(b1) ingredient]
[0337] ・Polybutadiene b1-1: 1,2-polybutadiene homopolymer, number average molecular weight = 1200, vinyl content = 85% or more
[0338] ・Polybutadiene b1-2: 1,2-polybutadiene homopolymer, number average mo...
Embodiment 1～5、 comparative example 1～3
[0344] Each component described in Table 2 is stirred and mixed at room temperature or heated at 50 to 80° C. while stirring and mixing according to the compounding amount (unit: parts by mass) described in Table 2 together with a predetermined amount of curing accelerator. The mixture was mixed to prepare a resin composition having a solid content (non-volatile content) concentration of about 50% by mass.
[0345] The resin composition obtained in each example was coated on a 38 μm thick PET film (manufactured by Teijin Corporation, trade name: G2-38), and then heated and dried at 170° C. for 5 minutes to prepare a resin film in a B-stage state. After peeling this resin film from a PET film, it grind|pulverizes and makes resin powder. Next, put the above-mentioned resin powder into a Teflon (registered trademark) sheet punched out to a size of 1 mm in thickness x 50 mm in length x 35 mm in width, and place a 18-μm-thick sheet on top and bottom of it so that the M surface is i...
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