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Semiconductor laser light source module and semiconductor laser light device

A technology of laser light source and laser device, applied in semiconductor laser device, semiconductor laser, laser device and other directions, can solve problems such as oscillating laser

Pending Publication Date: 2022-01-28
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the conventional technology, when outputting a light emission signal to one laser diode among a plurality of laser diodes, there is a problem that unnecessary laser light is oscillated from an adjacent laser diode.

Method used

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  • Semiconductor laser light source module and semiconductor laser light device
  • Semiconductor laser light source module and semiconductor laser light device
  • Semiconductor laser light source module and semiconductor laser light device

Examples

Experimental program
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Effect test

no. 1 approach

[0020] like figure 1 As shown, the semiconductor laser device 200 of this embodiment includes a connector 96, a capacitor 92, an LD driver 94, and the semiconductor laser light source module 100 of the first embodiment on a circuit board 90 which is a rigid printed wiring board. Hereinafter, the semiconductor laser light source module 100 is also simply referred to as the module 100 . exist figure 1 In , the illustration of the conductor wiring on the circuit board 90 is omitted.

[0021] The semiconductor laser device 200 is mounted on an optical distance measuring device such as LiDAR (Light Detection and Ranging: LiDAR), and is used as a laser light source for distance measurement. The semiconductor laser device 200 can also be used as a laser light source for various purposes such as an optical distance measuring device other than LiDAR, writing or reading of an optical disk, a laser printer, optical communication, lighting, a laser microscope, and a laser pointer.

[0...

no. 2 approach

[0051] use Figure 7 Next, the positional relationship between the upper electrode 88 of each emission portion 80 and the electrode pad 60i of the package-side positive electrode 60 constituted by the semiconductor laser light source module 100b of the second embodiment will be described. like Figure 7 As shown, the difference between the module 100 b of this embodiment and the module 100 of the first embodiment is that it includes eight emission portions 80 and eight electrode pads 60 i corresponding to each emission portion 80 .

[0052] Each emission part 80 is arranged in a row along the Y direction in a state in which the emission direction DL of the laser beam coincides, similarly to the first embodiment. exist Figure 7 In order to facilitate technical understanding, the eight emitting portions 80 are respectively referred to as emitting portions 80a to 80h sequentially along the Y direction, and the upper electrodes 88 of the emitting portions 80a to 80h are respect...

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PUM

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Abstract

A semiconductor laser light source module (100) is provided with: a laser diode (40) including upper electrodes (88) and lower electrodes (81) and having a plurality of output portions (80) for outputting laser light in one direction (DL), the output portions being arrayed with laser light output directions thereof aligned; a plurality of package-side electrodes (60) for supplying electric current to each of the plurality of output portions; and a plurality of first wires (W1) electrically connecting the upper electrodes respectively with package-side electrodes corresponding to the upper electrodes. One first wire connecting one of the plurality of arrayed output portions and a package-side electrode corresponding to the one output portion, and another first wire connecting another output portion adjacent to the one output portion and a package-side electrode corresponding to the another output portion are not parallel in a plan view.

Description

[0001] Cross References to Related Applications [0002] This application is based on Japanese Application No. 2019-113465 filed on June 19, 2019 and Japanese Application No. 2020-87166 filed on May 19, 2020, and the contents thereof are cited here. technical field [0003] The present disclosure relates to a semiconductor laser light source module and a semiconductor laser device. Background technique [0004] There is known a semiconductor laser light source module in which a plurality of laser diodes individually connected to a plurality of electrodes on a circuit board by bonding wires are arranged (for example, JP 2017-103271 A). [0005] In the conventional technology, when outputting an emission signal to one laser diode among a plurality of laser diodes, there is a problem that unnecessary laser light is oscillated from an adjacent laser diode. Contents of the invention [0006] The present disclosure is made to solve at least a part of the problems described abov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022H01S5/062H01S5/40
CPCH01S5/0239H01S5/02345H01S5/4031H01S5/02315H01S5/04256
Inventor 山田仁帆足善明
Owner DENSO CORP