Heat dissipation cabinet and communication equipment

Abstract

The embodiment of the invention relates to the technical field of heat dissipation, and relates to a heat dissipation cabinet and communication equipment. The heat dissipation cabinet is characterized in that: a first accommodating area of a cabinet body can accommodate a plugboard in a stacked manner, and a heat source device of the plugboard dissipates heat through a heat dissipation device; an evaporator, a condenser, an evaporation pipeline and a liquid return pipeline of the heat dissipation device are connected to form a heat exchange loop, the evaporator is in thermal contact with the outer surface of the heat source device, and the condenser is arranged in the second containing area and located above the evaporator; circulating flow of a refrigerant in the heat exchange loop is achieved, heat of a heat source device is pulled to the condenser, the heat of the condenser is taken away through blowing of a draught fan, and concentrated heat dissipation is achieved; a second accommodating area serves as an independent air duct, the air duct path is short, the air volume can be increased, and system resistance is reduced; the size of the condenser is increased, the heat dissipation area of convective heat exchange is increased, and the heat dissipation capacity is improved; and the condenser is moved out of the plugboard and serves as a heat dissipation resource pool, and the situation that the heat dissipation area of a radiator is limited by slot space and heat dissipation is poor due to uneven slot air volume is overcome.

Description

technical field [0001] The embodiments of the present application relate to the technical field of heat dissipation, and in particular, to a heat dissipation cabinet and communication equipment. Background technique [0002] With the development of high-capacity and high-density communication equipment, the chip capacity is getting larger and larger, and the method of stacking multiple cores in the chip is adopted, which leads to increasing power consumption of the system. The heat dissipation requirements of communication equipment are getting higher and higher, and the improvement space of heat dissipation capability determines the capacity of communication equipment and the competitiveness of long-term evolution. Such as Figure 1a and Figure 1b As shown, the existing communication equipment includes a cabinet body 1 and a plug board 2 with a chip 2a. The chip 2a is used as a heat source device and is provided with a radiator 3. The heat generated by the chip 2a is tran...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides a heat dissipation cabinet and communication equipment, which solves the problem that when the heat source devices in the existing communication equipment use radiat...

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