Manufacturing method of magnetic loss heat dissipation film and magnetic loss heat dissipation film
A production method and heat dissipation film technology, applied in the field of materials, can solve the problems of complex communication frequency, heat dissipation rate not exceeding, and inability to apply high thermal conductivity chips, etc., and achieve the effect of convenient use
Pending Publication Date: 2022-02-18
ZHEJIANG DAHUA TECH CO LTD
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] With the development of electronic technology, the communication frequency between different circuits is becoming more and more complex, resulting in greater power consumption, which in turn leads to stricter heat dissipation requirements for chips; the traditional filtering scheme uses ordinary absorbing materials, which can only The use of absorbing electromagnetic waves with fixed frequency points is limited, and the heat dissipation rate of traditional absorbing materials does not exceed 1W / m.K, while the heat dissipation requirements of many current chips are 3-5W / m.K, so this absorbing material cannot be used in high-temperature applications. thermal chip
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0015] The application will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present application, but not to limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application but not all of them, and all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.
[0016] Reference in this application to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| Thermal conductivity | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a manufacturing method of a magnetic loss heat dissipation film and the magnetic loss heat dissipation film. The method comprises the steps of carrying out mixing treatment on a wave-absorbing material and a heat dissipation material with different component proportions, and obtaining various types of magnetic loss heat dissipation slurry; performing coating treatment on the magnetic loss heat dissipation slurry to obtain a corresponding pre-crosslinked film; stacking the plurality of pre-crosslinked films according to a preset stacking sequence, and carrying out lamination crosslinking to obtain a magnetic loss heat dissipation layer; and attaching the magnetic loss heat dissipation layer to a bonding layer to obtain the magnetic loss heat dissipation film. In this way, the heat dissipation requirement can be met while electromagnetic waves are absorbed.
Description
technical field [0001] The present application relates to the field of material technology, in particular to a method for manufacturing a magnetic loss heat dissipation film and a magnetic loss heat dissipation film. Background technique [0002] With the development of electronic technology, the communication frequency between different circuits is becoming more and more complex, resulting in greater power consumption, which in turn leads to stricter heat dissipation requirements for chips; the traditional filtering scheme uses ordinary absorbing materials, which can only The use of absorbing electromagnetic waves with fixed frequency points is limited, and the heat dissipation rate of traditional absorbing materials does not exceed 1W / m.K, while the heat dissipation requirements of many current chips are 3-5W / m.K, so this absorbing material cannot be used in high-temperature applications. on the thermal chip. Contents of the invention [0003] The present application pr...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): C09J7/29C08J5/18C08L101/00C08K3/04
CPCC09J7/29C08J5/18C09J2301/122C09J2301/162C09J2400/226C08J2300/00C08K3/042
Inventor 王雷孔阳
Owner ZHEJIANG DAHUA TECH CO LTD