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Production Method of electronic thermoelectric cooler

A technology of electronic refrigeration and production method, which is applied in the manufacture/processing of thermoelectric devices, parts and components of thermoelectric devices, etc., can solve the problems of poor refrigeration efficiency and low power density of electronic refrigeration sheets, and achieve improved refrigeration efficiency and power density, and improved Effect of thermal conductivity and high thermal conductivity

Pending Publication Date: 2020-02-28
深圳市汇城精密科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a production method of an electronic refrigerated sheet, aiming to solve the technical problems of poor refrigeration efficiency and low power density of the electronic refrigerated sheet in the prior art

Method used

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  • Production Method of electronic thermoelectric cooler
  • Production Method of electronic thermoelectric cooler

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Embodiment Construction

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the embodiments of the present invention and should not be construed as limitations of the present invention.

[0028] In one embodiment of the present invention, as Figure 1~2 As shown, a kind of production method of electronic refrigerating sheet is provided, comprising the following steps:

[0029] S100: Provide an aluminum substrate 10, and form an aluminum oxide insulating layer 20 on the surface of the aluminum substrate 10; preferably, the aluminum substrate 10 is made of pure aluminum;

[0030] S200: Fabricate a circuit layer 30 on the alumina insulating layer 20; the circuit layer 30 is fabricated on the...

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Abstract

The invention belongs to the technical field of refrigeration product production technology, and especially relates to a production method of an electronic thermoelectric cooler. The production methodof the electronic thermoelectric cooler comprises the following steps: S100: providing an aluminum substrate and manufacturing an alumina insulating layer on the surface of the aluminum substrate; S200: manufacturing a line layer on the alumina insulating layer; and S300: welding a plurality of refrigeration crystals on the line layer. Firstly, the alumina insulating layer is manufactured on thesurface of the aluminum substrate; then, the line lay is manufactured on the alumina insulating lay; and finally, the several refrigeration crystals are welded on the line layer. Due to the arrangement of the alumina insulating layer, the heat conduction effect can be achieved through the alumina insulating layer; and since there is almost no gap between the alumina insulating layer and the aluminum substrate and the alumina insulating layer has a higher thermal conductivity than a traditional insulating adhesive, the thermal conduction property of the aluminum substrate can be greatly improved, and the refrigeration efficiency and power density of the whole electronic thermoelectric cooler can be further improved.

Description

technical field [0001] The invention belongs to the technical field of production technology of refrigeration products, and in particular relates to a production method of an electronic refrigeration sheet. Background technique [0002] Most of the current refrigeration equipment needs to use fluoride as a refrigerant. The harm of fluoride to the atmospheric environment has long been recognized. Refrigeration equipment has penetrated into people's life and work, as well as production and scientific research. With the development of electronic refrigeration technology, it can gradually replace the refrigeration equipment with fluoride. [0003] At present, there are a large number of electronic refrigeration products on the market, but due to the limitations of electronic refrigeration devices, no mainstream products have yet been formed. In the production of electronic refrigeration devices, insulating materials with good thermal conductivity are required. Existing mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/08H01L35/10H01L35/34H10N10/817H10N10/01H10N10/82
CPCH10N10/82H10N10/817H10N10/01
Inventor 杨绍波
Owner 深圳市汇城精密科技有限公司
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