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58results about How to "Play the role of heat conduction" patented technology

Carbon fiber-based precoated sand material for selective laser sintering and preparation method thereof

The invention discloses a carbon fiber-based precoated sand material for selective laser sintering and a preparation method thereof. The carbon fiber-based precoated sand material comprises chopped carbon fibers, crude sand, an organic binder, a curing agent, a lubricant, a coupling agent and a dispersant. The preparation method comprises the following steps of carrying out surface modification treatment on the chopped carbon fibers, heating the crude sand, adding resin, adding a part of calcium stearate and a prepared coupling agent aqueous solution, adding a chopped fiber-containing urotropine curing agent, adding the rest of the calcium stearate, carrying out cooling and carrying out screening and sand discharge to obtain the product. The carbon fiber-based precoated sand material has the advantages that 1, the carbon fibers have thermal conduction effects, limit integral shrinkage of a sintered part to a certain degree and reduce warp phenomenon in molding, and 2, through laser sintering, the precoated sand substantially improves resin precoated sand thermostability, promotes curing reaction of phenolic resin at locals in the sintered layer and between the sintered layers and obviously improves laser sintering forming part blank strength.
Owner:NANCHANG HANGKONG UNIVERSITY

GaN-based power device with inverted structure having graphene heat dissipation layer and preparation method of GaN-based power device

The invention discloses a GaN-based power device with an inverted structure having a graphene heat dissipation layer and a preparation method of the GaN-based power device. The GaN-based power devicecomprises, distributed from bottom to top, a substrate, an insulating medium layer, an electrode bonding pad, a GaN-based HEMT device and graphene material, wherein the electrode bonding pad comprisesa source electrode bonding pad, a drain electrode bonding pad and a gate electrode bonding pad; the GaN-based HEMT device comprises an epitaxial layer structure, a gate electrode, a source electrodeand a drain electrode; and an electrode of the GaN-based HEMT device is bonded with the substrate through the electrode bonding pad, so that an inverted packaging structure is realized. The graphene material is adopted as a heat dissipation material on a substrate material of the inverted GaN-based HEMT device. The HEMT device is connected with the heat dissipation film through the electrode bonding pad, and graphene is adopted as a heat dissipation layer on the HEMT substrate in the inverted structure. The heat dissipation efficiency of the device is improved, and the long-term reliability ofthe device is ensured.
Owner:BEIJING HUATAN TECH CO LTD

Steel-aluminum joint welding device

The invention discloses a steel-aluminum joint welding device. The steel-aluminum joint welding device comprises a protective base, a heating base, conveying rollers, mounting grooves and a shell. The shell is internally provided with the mounting grooves. A feed port is arranged on one side of the sell at the mounting grooves. According to the steel-aluminum joint welding device, a thin copper plate is arranged between a steel plate and an aluminum alloy plate; the aluminum alloy plate and the steel plate make contact with a material guide tube through the thin copper plate; on the one hand, the steel plate and the thin copper plate are isolated through limiting of the thin copper plate, and the situation that the steel plate and the aluminum alloy plate make contact with each other and have a reaction in the heating process and the welding quality is affected by brittle compounds generated from the reaction is avoided; and on the other hand, the thin copper plate achieves the heat conduction effect and conducts heat generated from a heating barrel to the welding ends of the aluminum alloy plate and the steel plate through a delivery tube, a material guide tube and the thin copper plate in sequence to achieve the preheating effect on the steel plate and the aluminum alloy plate. The influence of bubbles generated from uneven heating in the welding process on the welding quality is reduced.
Owner:ANHUI UNIVERSITY OF TECHNOLOGY AND SCIENCE

Efficient surface-mounted triode with good heat dissipation structure

The invention discloses an efficient surface-mounted triode with a good heat dissipation structure and belongs to the technical field of surface-mounted triodes. The efficient surface-mounted triode comprises a packaging outer shell, a wear-resistant anti-cracking assembly and a heat dissipation assembly; pins are installed at the lower portion of the packaging outer shell; a sealing waterproof assembly is fixed to the outer sides of the joints of the pins and the packaging outer shell; the wear-resistant anti-cracking assembly is fixed to the outer side of the packaging outer shell; a fixingplate is integrally connected to the upper portion of the packaging outer shell; a threaded hole is formed in the middle of the fixing plate; a main body chip is installed in the middle of the interior of the packaging outer shell; a reinforced protection assembly is installed on the outer side of the main body chip; conductive layers are welded to the joints of the main body chip and the pins; and insulating layers are fixed to the upper side and the lower side of the main body chip respectively. According to the efficient surface-mounted triode of the invention, the sealing waterproof assembly is adopted, the connecting positions of the pins and the packaging outer shell can be conveniently prevented from being affected with damp and aged; and the heat dissipation assembly is adopted, sothat the efficient heat dissipation of the surface-mounted triode is facilitated.
Owner:GUANGDONG HOTTECH IND

Cable conveying device facilitating reeling

The invention discloses a cable conveying device facilitating reeling. Conveying directions of a plurality of conveying assemblies are alternate positively and reversely, heating plates are arranged above the conveying assemblies separately, and a steam generation mechanism is arranged on the bottom of a box; a cable inlet is formed in the upper portion of a first side wall of the box, and a cableoutlet is formed in the lower portion of a second side wall of the box; a switching through hole is formed in the end, which corresponds to an exiting end of the corresponding conveying assembly, ofthe first heating plate below each conveying assembly; a guiding block is arranged on the side, which is close to the inner wall of the box, of each switching through hole; a recessed arc-shaped groove is formed in the side, which faces the corresponding conveying assembly, of each guiding block; after being discharged from the cable outlet, a cable penetrates through the other end of a drying boxfrom one end of the drying box so that the cable can be dried, the bottom of the drying box is provided with a plurality of self-locking wheels and through holes, the self-locking wheels are placed on a water collecting trough, and water draining holes are formed in the bottoms of side walls of the water collecting trough. The conveying device can preheat the cable before reeling of the cable, and thus, the reeling effect is improved.
Owner:WUHU HANGTIAN SPECIAL CABLE FACTORY

Wavelength conversion device, light-emitting device and laser illuminating lamp

PendingCN106989301AImproved ease of installation and positioningPrevent movementSemiconductor devices for light sourcesReflectorsFluorescenceStray light
The invention discloses a wavelength conversion device, a light-emitting device and a laser illuminating lamp. The wavelength conversion device comprises a first reflecting substrate, a second reflecting substrate and a fluorescent layer arranged in the first reflecting substrate, wherein the first reflecting substrate and the second reflecting substrate are sequentially arranged from top to bottom, the first reflecting substrate is provided with a through hole matched with the fluorescent layer, the fluorescent layer is limited in the through hole, and the lower surface of the fluorescent layer is in contact with the upper surface of the second reflecting substrate. By forming the through hole matched with the fluorescent layer in the first reflecting substrate, the effect of positioning and limiting the fluorescent layer is played, the side wall of the through hole can reflect light emitted from the side face of the fluorescent layer back to the fluorescent layer, and formation of non-designated-direction stray light is avoided. The second reflecting substrate is arranged below the first reflecting substrate, the lower surface of the fluorescent layer is in contact with the upper surface of the second reflecting substrate, laser beams are prevented from being emitted from the lower portion of the fluorescent layer, meanwhile a heat conducting effect is played, and heat produced in the fluorescent layer is rapidly conducted out.
Owner:SUPERVISION LASER TECH SUZHOU CO LTD

A panoramic camera module

InactiveCN109089026AImproved heat dissipation and stabilityHigh strengthTelevision system detailsColor television detailsCamera lensHeat sink
The invention discloses a panoramic camera module, comprising a first lens group and a second lens group arranged in opposite directions, wherein the first lens group comprises a first fish-eye lens and a first photosensitive plate, wherein a first photosensitive chip is arranged on a side of the first photosensitive plate facing the first fish-eye lens; the second lens group comprises a second fisheye lens, a second photosensitive plate, and a second photosensitive chip arranged on the side of the second photosensitive plate facing the second fisheye lens. The panoramic camera module furthercomprises a heat dissipation bracket fixedly arranged between the first lens group and the second lens group, wherein the heat dissipation bracket comprises a support bracket main body and heat dissipation fins arranged on both sides of the support bracket main body, and the heat dissipation fins are provided with a plurality of grooves arranged at intervals. A perfect heat dissipation system is formed by using a special structure of heat dissipation bracket, fans, conductive silica gel, conductive cloth and other devices, which can effectively reduce the working temperature of the panoramic camera module.
Owner:TRULY OPTO ELECTRONICS

A High Efficiency SMD Transistor with Good Heat Dissipation Structure

The invention discloses a high-efficiency patch triode with a good heat dissipation structure, relates to the technical field of patch triodes, and includes a packaging shell, a wear-resistant and crack-proof component and a heat dissipation component. Pins are installed under the package shell. And the outer side of the connection between the pin and the package shell is fixed with a sealing and waterproof component, the wear-resistant and crack-proof component is fixed on the outside of the package shell, the upper part of the package shell is integrally connected with a fixing plate, and the fixing plate A threaded hole is provided in the middle, a main chip is installed in the middle of the package shell, and a reinforced protective component is installed on the outside of the main chip, a conductive layer is welded at the connection between the main chip and the pin, and the upper and lower sides of the main chip Insulation is fixed on both sides. The beneficial effect of the present invention is that: the device facilitates the prevention of moisture aging at the connection position between the pin and the package shell through the arrangement of the sealed waterproof component, and facilitates the efficient heat dissipation of the chip transistor through the arrangement of the heat dissipation component.
Owner:GUANGDONG HOTTECH IND

Auxiliary heat transfer mechanism, outboard load and space station

The invention relates to an auxiliary heat transfer mechanism, an outboard load and a space station. The auxiliary heat transfer mechanism is used for conducting heat of an outboard load radiating surface to a space station bulkhead cold plate, and comprises a heat conduction assembly and an electric pushing mechanism. The hot end of the heat conduction assembly is connected with an outboard loadradiating surface. The cold end of the heat conduction assembly is located on the free side of the electric pushing mechanism. Under the pushing of the electric pushing mechanism, the heat conductionassembly moves towards the space station bulkhead cold plate. After the electric pushing mechanism is powered on, the cold end of the heat conduction assembly is pushed to move towards the space station bulkhead cold plate; when the cold end of the heat conduction assembly abuts against the cold plate, the hot end of the heat conduction assembly is connected with the outboard load radiating surface such that the heat of the outboard load radiating surface can be conducted to the cold end of the heat conduction assembly through the hot end of the heat conduction assembly and then conducted to the space station bulkhead cold plate, therefore heat dissipation of the outboard load is achieved, unmanned outboard operation is achieved through the electric pushing mechanism, and heat dissipationof the outboard load is achieved only through electric signals.
Owner:TECH & ENG CENT FOR SPACE UTILIZATION CHINESE ACAD OF SCI

Electronic stop board adopting graphene for heat dissipation

The invention discloses an electronic stop board adopting graphene for heat dissipation. The stop board comprises a base, a stop board main body is fixedly connected to the top of the base, a displayscreen body is embedded in the front surface of the stop board main body, a loudspeaker is embedded in the top of the front surface of the stop board main body, a cavity is formed in the stop board main body, and four first mounting inner studs are fixedly connected to the front side of an inner cavity of the cavity. The electronic stop board solves the problem that a display on an electronic stop board is provided with a main board, a chip on the main board is used for main information processing, and during main board working, the chip can generate a large amount of heat, however, the purpose of heat dissipation of the chip on the main board is achieved in the mode that an aluminum sheet conducts heat, and the heat dissipation effect is poor, although a filter screen is arranged at theposition used for air inlet and air outlet, filter holes in the filter screen can be blocked due to too much external dust after long-time use, and heat dissipation of the chip on the main board is seriously affected.
Owner:汤米熊技术(深圳)有限公司

A kind of auxiliary heat transfer mechanism, external load and space station

The invention relates to an auxiliary heat transfer mechanism, an external load and a space station, which is used for conducting the heat of the heat dissipation surface of the external load to the cold plate of the bulkhead of the space station, including a heat conduction component and an electric driving mechanism, and the hot end of the heat conduction component is used to communicate with the space station The heat dissipation surface of the external load is connected. The cold end of the heat conduction component is located on the free side of the electric propulsion mechanism, and is driven by the electric propulsion mechanism to move towards the cold plate of the bulkhead of the space station. After the electric propulsion mechanism is powered on, the cold end of the heat conduction component is pushed towards the space station. When the cold plate of the bulkhead moves, when the cold end of the heat conduction component touches the cold plate, since the hot end of the heat conduction component is connected to the heat dissipation surface of the external load, the heat of the heat dissipation surface of the external load can be conducted to the heat conduction surface through the hot end of the heat conduction component. The cold end of the component is then transmitted to the cold plate of the bulkhead of the space station to realize the heat dissipation of the external load. The electric propulsion mechanism is used to realize unmanned external operation, and the heat dissipation of the external load is realized only by electrical signals.
Owner:TECH & ENG CENT FOR SPACE UTILIZATION CHINESE ACAD OF SCI

Signal laser emitter of unmanned aerial vehicle

The invention discloses a signal laser transmitter of an unmanned aerial vehicle. The invention relates to the technical field of laser transmitters. According to the technical scheme, the signal laser transmitter is characterized by comprising an overturning end; a transmitting end shell is arranged at the rear end of the overturning end; a power supply end shell is arranged at the rear end of the transmitting end shell; a fixed frame is arranged above the fixed plate; the front end of the fixed frame is connected with a clamping end plate; and side fixing groove plates are arranged at the left end and the right end of the clamping end plate correspondingly. Expansion slots are formed in the left side and the right side of the fixed frame; the expansion slots are formed in the fixed frame, a communication structure is formed between the expansion slots and the fixed frame, a contact block is fixed to the inner side face of the fixed frame, the contact block is connected with the fixedframe in a welded mode, and an attaching rubber pad is arranged on the upper surface of the contact block and embedded in the upper surface of the contact block. The structure can reduce resistance formed by the extra size in the moving process of the unmanned aerial vehicle; meanwhile, air filling ventilation is conducted on the internal structure, and the temperature of the heating assembly isfurther reduced.
Owner:NANJING KAITIANYAN UAV TECH CO LTD

GaN-based power device with inverted structure of graphene heat dissipation layer and preparation method thereof

The invention discloses a GaN-based power device with an inverted structure having a graphene heat dissipation layer and a preparation method of the GaN-based power device. The GaN-based power devicecomprises, distributed from bottom to top, a substrate, an insulating medium layer, an electrode bonding pad, a GaN-based HEMT device and graphene material, wherein the electrode bonding pad comprisesa source electrode bonding pad, a drain electrode bonding pad and a gate electrode bonding pad; the GaN-based HEMT device comprises an epitaxial layer structure, a gate electrode, a source electrodeand a drain electrode; and an electrode of the GaN-based HEMT device is bonded with the substrate through the electrode bonding pad, so that an inverted packaging structure is realized. The graphene material is adopted as a heat dissipation material on a substrate material of the inverted GaN-based HEMT device. The HEMT device is connected with the heat dissipation film through the electrode bonding pad, and graphene is adopted as a heat dissipation layer on the HEMT substrate in the inverted structure. The heat dissipation efficiency of the device is improved, and the long-term reliability ofthe device is ensured.
Owner:BEIJING HUATAN TECH CO LTD

Device for eliminating welding cracks and pores of aluminum-steel dissimilar metal

The invention discloses a device for eliminating welding cracks and pores of aluminum-steel dissimilar metal. The device comprises a casing, a welding chamber, a far-infrared heater, a water storage chamber and a protective seat, wherein the water storage chamber is arranged at the inner bottom end of the casing; the casing above the water storage chamber is internally provided with the welding chamber. According to the device disclosed by the invention, a copper sheet is arranged between a steel plate and an aluminum alloy plate; the aluminum alloy plate and the steel plate are respectively contacted with a material guiding pipe by using the copper sheet; on the one hand, the condition that the steel plate and the aluminum alloy plate are contacted and react to generate a brittle compound in the heating process is avoided by use of the limiting action of the copper sheet; on the other hand, the copper sheet realizes a heat conduction effect, and conducts the heat produced by a heating barrel to welding ends of the aluminum alloy plate and the steel plate separately for preheating the steel plate and the aluminum alloy plate, so that the phenomenon that the welding quality is affected as bubbles are produced because of nonuniform heating in the welding process is reduced; a weld seam is integrally welded after the copper sheet is heated and melted so as to improve the welding effect.
Owner:ANHUI UNIVERSITY OF TECHNOLOGY AND SCIENCE

Production Method of electronic thermoelectric cooler

The invention belongs to the technical field of refrigeration product production technology, and especially relates to a production method of an electronic thermoelectric cooler. The production methodof the electronic thermoelectric cooler comprises the following steps: S100: providing an aluminum substrate and manufacturing an alumina insulating layer on the surface of the aluminum substrate; S200: manufacturing a line layer on the alumina insulating layer; and S300: welding a plurality of refrigeration crystals on the line layer. Firstly, the alumina insulating layer is manufactured on thesurface of the aluminum substrate; then, the line lay is manufactured on the alumina insulating lay; and finally, the several refrigeration crystals are welded on the line layer. Due to the arrangement of the alumina insulating layer, the heat conduction effect can be achieved through the alumina insulating layer; and since there is almost no gap between the alumina insulating layer and the aluminum substrate and the alumina insulating layer has a higher thermal conductivity than a traditional insulating adhesive, the thermal conduction property of the aluminum substrate can be greatly improved, and the refrigeration efficiency and power density of the whole electronic thermoelectric cooler can be further improved.
Owner:深圳市汇城精密科技有限公司
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