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Nitride-based power device with carbon nanotube micro channel radiator and preparation method of power device

A carbon nanotube and power device technology, applied in the field of new structure and its preparation, can solve the problems of poor heat dissipation and low reliability, improve thermal stability and long-term working reliability, and increase the area of ​​heat dissipation , Improve the cooling effect

Active Publication Date: 2018-08-03
BEIJING HUATAN TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of poor heat dissipation effect and low reliability of GaN power devices under the positive structure, the present invention proposes a new flip-chip structure based on CNT microchannel heat sink and its preparation method, and uses CNT microchannel heat dissipation on the flip-chip structure The heat dissipation of the device effectively reduces the peak junction temperature of the AlGaN / GaN HEMT device, increases the current density of the device, and suppresses the current collapse effect of the device, thereby improving the stability and stability of GaN-based microwave power devices under high-power and high-voltage conditions. reliability

Method used

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  • Nitride-based power device with carbon nanotube micro channel radiator and preparation method of power device
  • Nitride-based power device with carbon nanotube micro channel radiator and preparation method of power device
  • Nitride-based power device with carbon nanotube micro channel radiator and preparation method of power device

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Embodiment Construction

[0028] The invention relates to a novel flip-chip structure which adopts a CNT array radiator to improve the heat dissipation of an AlGaN / GaN high electron mobility transistor. In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0029] figure 1 A schematic diagram showing the epitaxial structure of a highly reliable AlGaN / GaN high electron mobility transistor according to an embodiment of the present invention, which includes the following parts:

[0030] [1]: Under the premise of knowing the conventional AlGaN / GaN device structure, the substrate material 1 of the chip is SiC, sapphire or Si material.

[0031] [2]: Under the premise of knowing the conventional AlGaN / GaN device structure, the GaN high-resistance buffer layer 2 of the epitaxial structure of the chip.

[0032] [3]...

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Abstract

The invention discloses a nitride-based power device with a carbon nanotube micro channel radiator and a preparation method of the power device. The device comprises a substrate, an insulating dielectric layer, electrode pads, a GaN-based HEMT device and a CNT micro channel radiator distributed from bottom to top; the electrode pads include a source electrode pad, a drain electrode pad and a gateelectrode pad; the GaN-based HEMT device comprises an epitaxial layer structure, a gate electrode, a source electrode and a drain electrode; the electrodes of the GaN-based HEMT device are aligned, the electrode pads are bonded and connected with the substrate, and an upside-down packaging structure is realized; and the CNT micro channel radiator used on the substrate material of the upside-down GaN-based HEMT device and serves as a radiating channel between the outside and the device surface. A self-heating effect of the GaN-based HEMT device is reduced, the thermal resistance of the device is reduced, and the thermal reliability of the GaN-based HEMT device under strong electric field, high temperature and large power are improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor microelectronics, and in particular relates to a novel structure and a preparation method for improving the heat dissipation effect of an AlGaN / GaN HEMT flip-chip device through a carbon nanotube microchannel radiator. Background technique [0002] GaN materials have good thermal and electrical properties and chemical stability, such as wide band gap, high breakdown electric field, high thermal conductivity, corrosion resistance and radiation resistance, etc., and are ideal for preparing high frequency, high temperature, high voltage, high power devices ideal material. [0003] AlGaN / GaN heterojunction has extremely strong piezoelectric polarization and spontaneous polarization effects, forming a high concentration of two-dimensional electron gas (2DEG) at the heterojunction interface, high electron mobility transistor based on AlGaN / GaN heterojunction (HEMT) have broad application prospect...

Claims

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Application Information

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IPC IPC(8): H01L23/373H01L23/467H01L21/603
CPCH01L23/373H01L23/3738H01L23/467H01L24/81H01L2224/81201
Inventor 梁世博
Owner BEIJING HUATAN TECH CO LTD
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