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Sensor assembly and electronic equipment

A sensor component and sensor technology, applied in the direction of measuring instrument components, instruments, aircraft, etc., can solve problems such as inaccurate sensor measurement results, sensor damage, and detachment of fixed objects

Pending Publication Date: 2022-02-18
GEER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to at least solve the problems in the prior art that vibrations cause inaccurate sensor measurement results, sensor damage and separation from fixtures

Method used

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  • Sensor assembly and electronic equipment
  • Sensor assembly and electronic equipment
  • Sensor assembly and electronic equipment

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Embodiment Construction

[0031] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0032] It should be understood that the terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may also be meant to include the plural forms unless the context clearly dictates otherwise. The terms "comprising", "comprising", "containing" and "having" are inclusive and thus indicate the presence of stated...

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Abstract

The invention belongs to the technical field of electronic equipment and particularly relates to a sensor assembly and electronic equipment. The sensor assembly comprises a sensor, a fixture and at least one connector, wherein the sensor is connected to the fixture through the at least one connector, the connector comprises at least one flexible part and a rigid part, the flexible part is connected with an end part of the rigid part, the flexible part is connected with the sensor, and the rigid part is connected with a fixed object, or the flexible part is connected with the fixed object, and the rigid part is connected with the sensor. According to the sensor assembly provided by the embodiment of the invention, when the electronic equipment generates slight vibration, the flexible part can generate deformation to absorb vibration, so effects of buffering and damping are achieved, and measurement precision of the sensor is ensured. When the electronic equipment falls off and connection between the sensor and the fixed object cannot be ensured by the deformation of the flexible part, the rigid part can make up the defect of the flexible part in the aspect of supporting performance.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment, and in particular relates to a sensor component and electronic equipment. Background technique [0002] This document provides background information related to the present disclosure only and is not necessarily prior art. [0003] At present, many electronic products, such as drones, VR glasses, game controllers, etc., are equipped with sensors such as gravity sensors or gyroscopes. Such sensors are very sensitive to vibrations. state, causing the sensor to be in a vibration environment, and excessive vibration levels will make it difficult for the sensor to ensure high measurement accuracy, and even damage the components in the sensor, and the sensor will be separated from the fixed object. Contents of the invention [0004] The purpose of the present invention is to at least solve the problems in the prior art that vibrations cause inaccurate sensor measurement results, damage ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D11/00G01C19/04G01V7/02G01V7/16A63F13/24A63F13/28B64C39/02F16F15/04
CPCG01D11/00G01C19/04G01V7/02G01V7/16F16F15/04A63F13/28A63F13/24B64C39/028
Inventor 王天佐
Owner GEER TECH CO LTD
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