High-reliability solder paste printing screen

A solder paste printing and reliable technology, applied in printing, printing machine, screen printing and other directions, can solve the problems of less tin, missing printing, unreasonable opening design, etc., to avoid less tin, avoid missing printing, good hardware The effect of connection and soldering reliability

Pending Publication Date: 2022-03-01
SHENZHEN BESTWORK SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The invention provides a solder paste printing screen to solve the problems of tin connection, missing printing and less tin caused by unreasonable opening design in the solder paste printing screen in the prior art

Method used

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  • High-reliability solder paste printing screen

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0031] Directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", "top" Words such as "bottom" and "bottom" only refer to the orientation of the drawings, and the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0032] Words such as "first" and "second" in the terminology of the present invention are only used for des...

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Abstract

The invention provides a high-reliability solder paste printing screen which comprises a printing screen body, the printing screen body comprises a base plate and at least one boss, the boss is arranged on the base plate, a plurality of first printing through holes are formed in the base plate at intervals, a plurality of second printing through holes are formed in the boss at intervals, and the first printing through holes are communicated with the second printing through holes. The distance between any two adjacent second printing through holes is smaller than the distance between any two adjacent first printing through holes, the distance between any two adjacent second printing through holes is smaller than 0.2 mm and larger than 0.1 mm, the thickness of the base plate ranges from 0.1 mm to 0.15 mm, and the thickness of the boss is 20%-25% of the thickness of the base plate.

Description

technical field [0001] The invention relates to the field of surface mount technology, in particular to a solder paste printing screen. Background technique [0002] Surface mount technology (SMT) mainly includes: solder paste printing, precise placement and reflow soldering, among which the quality of solder paste printing has a great influence on the quality of surface mount products. [0003] The application and coating process of solder paste can be divided into two methods: one is to use the screen as a printing plate to print the solder paste on the PCB, which is suitable for mass production and is currently the most commonly used coating method; the other is It is injection coating and solder paste printing technology, which is a non-screen technology. [0004] The printing screen is a mold used to print solder paste. In the SMT process, first, according to the position of the pad on the printed circuit board, a printing hole is opened on the corresponding position ...

Claims

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Application Information

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IPC IPC(8): B41F15/36H05K3/12
CPCB41F15/36H05K3/1225B41P2215/12Y02P70/50
Inventor 卢雯
Owner SHENZHEN BESTWORK SCI & TECH CO LTD
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