Photovoltaic module and its preparation method

Abstract

The invention discloses a photovoltaic module and a preparation method thereof. The photovoltaic module includes a plurality of cell groups, a first conductive film, a first bus bar and a second bus bar, and the plurality of cell groups are arranged in sequence along a column direction, so that The battery sheet group includes a plurality of battery sheets arranged in sequence along the row direction, and any two adjacent battery sheets in the row direction are connected through the first conductive film, wherein the first conductive film is coated on both sides On the bottom surface of one of the battery slices and the top surface of the other of the two battery slices, one of the two battery slices at the edge of each of the battery slice groups is connected to the two battery slices. The first bus bar is connected, and the other of the two battery slices located at the edge of each battery slice group is connected to the second bus bar. The photovoltaic module provided by the invention has the advantages of small connection resistance between cells, large effective area of ​​cells and high CTM rate.

Description

technical field [0001] The invention relates to the technical field of photovoltaic manufacturing, in particular to a photovoltaic module and a preparation method thereof. Background technique [0002] At present, photovoltaic module packaging technologies include full-chip, half-chip and shingled packaging methods. Among them, the full-chip and half-chip packaging methods require the use of solder ribbons. The solder ribbons themselves will cover a part of the photovoltaic cell area to affect light absorption. At the same time, due to the flexibility of the solder ribbons themselves, the solder ribbons need to be left between the front and rear cells in series. A certain gap can avoid cracks in the cells, which together make it difficult to improve the CTM rate of full-cell and half-cell modules. Shingled modules need to overlap and overlap the cells. Although the CTM rate is high, the loss of cell area due to overlapping is unavoidable. [0003] On the other hand, curren...

AI Technical Summary

Problems solved by technology

ITO targets and low-temperature silver paste materials have high cost and high resistivity, which restrict the development of heterojunction cells in terms of performance and economy.

Images