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Wafer drying system and wafer drying method

A wafer drying and wafer technology, which is applied in drying chamber/container, drying solid material, drying gas arrangement, etc., can solve the high risk of secondary contamination, low applicability of high-end process, and uncontrollable air turbulence in space and other issues, to achieve the effect of reducing the risk of secondary contamination, small impact damage, and small impact effect

Pending Publication Date: 2022-03-04
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

However, the high-speed spin-drying drying method has uncontrollable air turbulence in the inner space of the chamber, and the risk of secondary contamination is relatively high. Due to the high-speed rotation and the impact of air and water flow to generate large surface forces, the applicability of high-end processes is low.

Method used

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  • Wafer drying system and wafer drying method
  • Wafer drying system and wafer drying method
  • Wafer drying system and wafer drying method

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Embodiment 1

[0026] refer to Figure 1-Figure 2 , the present embodiment provides a wafer drying system, comprising:

[0027] Rotary double-sided gradient drying device; rotary double-sided drying device includes:

[0028] The spin chuck 3 is adapted to fix the wafer 14 from the side for horizontal rotation.

[0029] The gradient drying assembly includes an upper assembly and a lower assembly, and the rotary chuck 3 is located between the upper assembly and the lower assembly. The gradient drying component is suitable for performing gradient drying on the wafer from the upper and lower sides simultaneously when the wafer is rotating horizontally.

[0030] The wafer drying system provided in this embodiment can fix the wafer 14 to rotate horizontally through the rotary chuck 3, and at the same time, gradient drying components are arranged on the upper side and the lower side, and the gradient drying can be performed on the upper and lower sides of the wafer at the same time. The horizont...

Embodiment 2

[0041] refer to Figure 1 ~ Figure 3 , This embodiment provides a wafer drying method, using the wafer drying system provided in Embodiment 1 above to perform synchronous rotary gradient drying on the upper and lower sides of the wafer.

[0042] Among them, the rotary chuck fixes the wafer to rotate horizontally; the gradient drying component performs gradient drying from the center of the wafer to the edge of the wafer.

[0043] Specifically, the steps of gradient drying include:

[0044] The gradient drying component lays a diversion liquid on the surface of the wafer, and the diversion liquid covers the surface of the wafer under the action of the centrifugal force generated when the wafer rotates to form a diversion liquid film.

[0045] The gradient drying component sprays purge gas to the surface of the wafer, and purges the diversion liquid film from the center of the wafer to the edge of the wafer.

[0046] The gradient drying component moves the heated diversion liq...

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Abstract

The invention provides a wafer drying system and a wafer drying method. The wafer drying system comprises a rotary double-sided gradient drying device; the rotary type double-sided drying device comprises a rotary chuck which is suitable for fixing a wafer from the side part to carry out horizontal rotation; the gradient drying assembly comprises an upper assembly and a lower assembly, and the rotating chuck is located between the upper assembly and the lower assembly; the gradient drying assembly is suitable for conducting gradient drying on the wafer from the upper side and the lower side at the same time when the wafer rotates horizontally.

Description

technical field [0001] The invention relates to the technical field of wafer manufacturing, in particular to a wafer drying system and a wafer drying method. Background technique [0002] With the development of integrated circuit manufacturing technology, the requirements for wafer surface cleanliness in its process control are getting higher and higher. After a large number of wet processes and cleaning processes, efficient and stable drying processes can effectively ensure surface cleanliness. To prevent the occurrence of secondary contamination; a process method in the prior art is centrifugal drying. Centrifugal drying is a drying technology that uses external force to make single or multiple wafers in a fixed state reach a high-speed rotation state in a short period of time, and the liquid film on the surface of the wafer is detached from the surface by centrifugal force. This drying method is simple and reliable, and has been widely used in the field of wafer cleanin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F26B11/18F26B5/08F26B21/10F26B21/14F26B25/18H01L21/02H01L21/67
CPCF26B11/18F26B25/185F26B5/08F26B21/14F26B21/10H01L21/67034H01L21/02041
Inventor 张康舒福璋崔凯
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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