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Double-side plastic packaging method of circuit board and double-side plastic packaged circuit board

A circuit board and double-sided circuit board technology, which is applied in the direction of circuits, printed circuits, and printed circuits connected with non-printed electrical components, can solve time-consuming and labor-intensive problems, achieve simple operation methods, improve production efficiency, and reduce plastic packaging. The effect of times

Pending Publication Date: 2022-03-04
QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, one side of the circuit board is plastic-sealed first, and then the other side of the circuit board is plastic-sealed, which is time-consuming and laborious

Method used

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  • Double-side plastic packaging method of circuit board and double-side plastic packaged circuit board
  • Double-side plastic packaging method of circuit board and double-side plastic packaged circuit board

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Embodiment Construction

[0038] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0039] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0040] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0041] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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PUM

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Abstract

The invention discloses a double-side plastic packaging method of a circuit board and a double-side plastic packaged circuit board. The double-side plastic packaging method of the circuit board comprises the following steps: mounting electronic devices on the front side and the back side of the circuit board; mounting a supporting piece on the front surface or the back surface of the circuit board, wherein the height of the supporting piece is higher than that of the electronic device; erecting the circuit board on a substrate through the support member, and fixedly connecting the support member and the substrate to obtain a member to be plastically packaged; and fixing the to-be-plastically-packaged part in a plastic packaging mold, and filling the front surface and the back surface of the circuit board with a plastic packaging material to obtain the double-surface plastically-packaged circuit board. According to the double-side plastic packaging method of the circuit board provided by the invention, double-side plastic packaging of the circuit board can be realized at one time, the plastic packaging frequency is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of plastic sealing of circuit boards, and more specifically, to a method for double-sided plastic sealing of circuit boards and a circuit board with double-sided plastic sealing. Background technique [0002] In some circuit boards used for precision instruments, in order to protect the circuit performance from being affected by environmental factors such as moisture and foreign matter, the circuit board is usually packaged. Encapsulation can be achieved by using wax or asphalt as a sealant, or by encapsulating the entire circuit board with a plastic encapsulant. [0003] In the prior art, although there are many advantages in encapsulating circuit boards by means of plastic encapsulation, for the encapsulation of double-sided printed circuit boards, two plastic encapsulation processes are usually required. That is, one side of the circuit board is plastic-sealed first, and then the other side of the circui...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L23/31H05K1/18
CPCH01L21/56H01L21/568H01L23/3107H01L23/3121H05K1/181
Inventor 韩阿润劉家政
Owner QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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