Grabbing mechanism for chip processing

Abstract

The invention provides a grabbing mechanism for chip processing, and relates to the field of chip processing. The grabbing mechanism for chip processing comprises two sliding rails and a placing mechanism, a base is arranged between the two sliding rails and the placing mechanism, sliding rods are fixedly installed at the four corners of the base, the placing mechanism is slidably connected with the upper surface of the base, an air cavity A is formed in the position, located on the placing mechanism, of the upper portion of the base, and the interior of the air cavity A is of a hollow structure; two ventilation pipes communicated with the interior of the air cavity A are installed on the air cavity A. Lantern rings are fixedly installed at the four corners of the air cavity A. The four sliding rods penetrate through the four lantern rings correspondingly and then are sleeved with nuts in a threaded mode, and springs are arranged outside the sliding rods and located between the base and the lantern rings in a sleeving mode. Compared with the prior art, the grabbing mechanism for chip processing has the advantages that the appearance of a chip can be well protected when the chip is transferred, pins of the chip are fragile, the pins of the chip can be well protected through the grabbing mode, and the situation that the pins are broken and bent is avoided.

Description

technical field [0001] The invention relates to the field of chip processing, in particular to a gripping mechanism for chip processing. Background technique [0002] A chip is a general term for a semiconductor component product. It is the carrier of an integrated circuit. The silicon chip containing the integrated circuit is an important part of a computer or other electronic equipment due to its small size and powerful functions. [0003] In the process of chip manufacturing, it is usually necessary to package the chip, that is, to assemble the chip inside the chip box, and then seal the chip box through the box cover, so as to complete the processing of the chip. The packaging process is the chip manufacturing process. One of the main processes in the process, the chip needs to be transferred with some grabbing devices when it is transferred, but the traditional grabbing device is very easy to damage the pins of the chip. Contents of the invention [0004] Aiming at t...

AI Technical Summary

Problems solved by technology

[0003] In the process of chip manufacturing, it is usually necessary to package the chip, that is, to assemble the chip inside the chip box, and then seal the chip box through the box cover, so as to complete the processing of the chip. The packaging process is the chip manufacturing process. One of the main processes in the process, the chip needs to be transferred with some grabbing devices when it is transferred, but the traditional grabbing device is very easy to damage the pins of the chip

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