Heat pipe radiator, refrigerator, wine cabinet, dehumidifier and water dispenser

A technology of heat pipe radiators and radiators, which is applied in the fields of dehumidifiers, water dispensers, wine cabinets, and refrigerators, and can solve problems such as low production efficiency, many process links, and dependence on welding workers

Pending Publication Date: 2022-03-11
王乾新 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a heat pipe radiator for dissipating heat from semiconductor refrigerating sheets, especially radiators for semiconductor refrigerating refrigerators, wine cabinets, dehumidifiers and water dispensers. There are many technical links, many special equipment, relying on welding workers, low production efficiency and high production cost.

Method used

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  • Heat pipe radiator, refrigerator, wine cabinet, dehumidifier and water dispenser
  • Heat pipe radiator, refrigerator, wine cabinet, dehumidifier and water dispenser
  • Heat pipe radiator, refrigerator, wine cabinet, dehumidifier and water dispenser

Examples

Experimental program
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Effect test

Embodiment 1

[0021] Embodiment 1, a kind of refrigerator that adopts semi-conductor refrigerating sheet to refrigerate, the heat sink that the heat-generating surface of this refrigerator semi-conducting refrigerating sheet adopts is a kind of such as figure 1 The shown heat pipe radiator for dissipating heat from semiconductor cooling fins includes a set of multiple heat pipes; in addition, it also includes a fixture 3 for fixing the heat pipe 1 .

[0022] In this embodiment, the heat pipe 1 includes an evaporating section and a condensing section that are extruded from aluminum or aluminum alloy, sealed with welded ports, and filled with a phase-change heat transfer fluid in the inner cavity. The whole heat pipe 1 is composed of two sections: an evaporation section and a condensation section. In this embodiment, the heat at the hot end of the semiconductor refrigerating sheet adopts the heat transfer and heat dissipation mode of the heat pipe, and only using such a heat pipe can make the...

Embodiment 2

[0026] Embodiment 2 is a kind of wine cabinet that adopts semiconductor refrigeration sheet to refrigerate, and the radiator that the heating surface of this refrigerator semiconductor refrigeration sheet adopts is a kind of radiator figure 2 The shown heat pipe radiator for dissipating heat from semiconductor cooling fins includes a set of multiple heat pipes; in addition, it also includes a fixture 3 for fixing the heat pipe 1 . The main difference between the heat pipe radiator for heat dissipation of semiconductor cooling fins and the heat pipe radiator for cooling semiconductor cooling fins in the refrigerator in Embodiment 1 is that multilayer heat pipes 1 are laminated on the thermal surface of semiconductor cooling fins. Among them, the outer surface of the heat pipe 1 has at least a pair of planes parallel to each other, forming a first heat conduction surface and a second heat conduction surface to realize the stacking of the multilayer heat pipe 1 .

[0027] In thi...

Embodiment 3

[0028] Embodiment 3, a kind of water dispenser that adopts semi-conductor refrigeration piece to refrigerate, the radiator that the heat-generating surface of this refrigerator semi-conductive refrigeration piece adopts is a kind of such as image 3 Shown is a heat pipe radiator that dissipates heat to a semiconductor cooling fin. Such as image 3 As shown, in the heat pipe radiator for dissipating heat from semiconductor cooling fins in the water dispenser, the two ends of the evaporation section of the heat pipe 1 are extended to form two condensation sections.

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PUM

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Abstract

The invention relates to a heat pipe radiator for radiating a semiconductor chilling plate, a refrigerator, a wine cabinet, a dehumidifier and a water dispenser, and the heat pipe radiator for radiating the semiconductor chilling plate realizes the heat transfer and radiating function through a heat pipe; the heat pipe is formed by extruding aluminum or aluminum alloy, a port is welded and sealed, and a cavity is vacuum and filled with a phase change heat transfer working medium. The outer surfaces of the evaporation sections of the heat pipes are arranged on the same plane and are tightly attached to a heat source; condensation sections of the heat pipes are distributed in the space in a scattered mode, and the heat pipes are linear or bent. The refrigerator, the wine cabinet, the dehumidifier and the water dispenser all adopt semiconductor chilling plates for refrigeration, and the heat pipe radiator for radiating the semiconductor chilling plates is used. According to the invention, the radiator is redesigned, so that the technical problems of more process links, more special equipment, dependence on welding workers, low production efficiency and high production cost in the radiator manufacturing process are solved.

Description

technical field [0001] The invention relates to a radiator for dissipating heat from a semiconductor refrigerating sheet, and a refrigerator, a wine cabinet, a dehumidifier and a water dispenser using the semiconductor refrigerating sheet. Background technique [0002] Semiconductor refrigeration technology has important applications in the field of home appliances, such as small refrigerators, freezers, wine coolers and water dispensers. When the semiconductor refrigerator is working, it is necessary to dissipate heat from the heating surface of the semiconductor refrigerator. [0003] Chinese Patent Application Publication No. CN104748492A discloses a heat pipe radiator for a semiconductor refrigeration refrigerator, which includes an evaporator, an evaporation coil, cooling fins and a fixed baffle. The fixed baffle is provided with longitudinal openings and transverse openings, and the center distance between the adjacent evaporation coils between the openings is greater...

Claims

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Application Information

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IPC IPC(8): F28D15/04F25B21/02
CPCF28D15/04F25B21/02F25B2321/0252
Inventor 王乾新
Owner 王乾新
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