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Packaged electronic module and manufacturing method thereof

A technology for electronic modules and packaged electronics, applied in circuits, electrical components, electrical solid devices, etc., can solve problems that do not include embedded electronic devices, and achieve the effect of avoiding capital expenditure and reducing unit cost

Pending Publication Date: 2022-03-11
ELLIPSE WORLD INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method does not include embedded electronics
Also, this method of manufacturing cards by lamination is very difficult to do and only a few card manufacturers can do it properly

Method used

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  • Packaged electronic module and manufacturing method thereof
  • Packaged electronic module and manufacturing method thereof
  • Packaged electronic module and manufacturing method thereof

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Embodiment approach

[0039] According to an exemplary embodiment of the invention, packaged electronics module 120 may generally include a contact plate 142, one or more electronic readers 138, one or more integrated circuit (IC) chips 144, a plurality of electronic components 146, and packaged electronics Module 120 is any other component or element required to perform its function. this is in figure 2 , image 3 , Figure 4 , Figure 5 , Image 6 , Figure 7A-Figure 7C , Figure 9A-9C , Figure 11A-Figure 11C , Figure 13A-Figure 13C , Figure 14 and Figure 15A-Figure 15C shown in , the reference may correspond to figure 1 The packaged electronic module 120 is a packaged electronic module. As such, a packaged electronic module may be a self-contained unit that may include all essential components required to perform its functions. Therefore, the packaged electronic module 120 may also be referred to as an integrated component.

[0040] Contact plate 142 may enable module 120 to ma...

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PUM

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Abstract

The present invention is a packaged electronic module with embedded electronics for a smart card. The invention assembles a plurality of electronic components on a flexible printed circuit together with an integrated circuit chip and a contact plate into a module. The card manufacturer may then embed the module in a plastic card using conventional milling techniques. The method encapsulates a plurality of electronic components into a module. The present invention provides enterprises with the ability to avoid the additional capital expenditure required for dedicated devices and enables all existing card manufacturers to manufacture smart cards with embedded electronics.

Description

[0001] Cross References to Related Applications [0002] This application is a continuation-in-part of US Patent Application Serial No. 15 / 645,234, filed July 10, 2017, which is hereby incorporated by reference in its entirety for all purposes. technical field [0003] The present invention relates to electronic modules, and more particularly, to packaged electronic modules with embedded electronics for use in smart cards. Background technique [0004] Semiconductor technology has made tremendous progress over the past few decades. Contactless smart cards are currently widely used in many fields such as the transportation sector and the banking sector to identify people and objects. Smart cards, also known as chip cards and IC cards, are plastic cards that contain one or more semiconductor chips. In most applications, smart cards are contactless, which means that the smart card utilizes radio frequency (RF) technology to perform data transfer between the card and the recei...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/14G06K19/07
CPCG06K19/07749G06K19/07707G06K19/07709G06K19/0718G06K19/07747G06K19/07743
Inventor C·拉洛S·波基克J·埃塞巴格
Owner ELLIPSE WORLD INC