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PCB (printed circuit board) back drilling process

A PCB board and back-drilling technology, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problem of small diameter of non-metallized holes and metallized holes

Inactive Publication Date: 2022-03-18
珠海杰赛科技有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a PCB back drilling process to solve the current technical problem that the diameter of the non-metallized hole is smaller than the diameter of the metallized hole, avoiding the back-drilling metallization Metal wire burrs are generated at the connection position between the hole and the non-metallized hole to prevent copper residue on the hole wall

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  • PCB (printed circuit board) back drilling process
  • PCB (printed circuit board) back drilling process
  • PCB (printed circuit board) back drilling process

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Embodiment Construction

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are intended to explain the present invention and is not intended to limit the invention.

[0029] It should be noted that when the element is referred to as "fixed to" or "set to" another element, it can be directly on the other element or indirectly on the other element. When a component is called "connected to" another element, it can be directly connected to another element or indirectly connected to the other element.

[0030] Moreover, the term "first", "second" is used only for the purpose of describing, and cannot be understood as an indication or implies a relative importance or implicitting the number of indicated techniques. Thus, features with "first", ...

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Abstract

The invention relates to the technical field of circuit board processing, and provides a PCB (Printed Circuit Board) back drilling process, which comprises the following steps of: S1, selecting a multi-layer board; s2, drilling / milling holes in a depth-controlled manner; step S3 and step S4, drilling a through hole; s5, copper deposition and electroplating; and S6, hole expanding is conducted. Compared with the prior art, the technical problem that the non-metallized hole with the diameter smaller than that of the metallized hole cannot be produced at present is solved, metal wire burrs are prevented from being generated at the joint position of the back-drilled metallized hole and the non-metallized hole, and copper residues on the hole wall are prevented.

Description

Technical field [0001] The present invention relates to the field of circuit board processing, and more particularly to a PCB plate back drilling process. Background technique [0002] With the development of the electronics industry, the volume of electronic products is getting smaller and larger, and the density of the device is getting larger, and the backplane is also developing in the miniaturization direction. At present, some backplanes are inserted into two different signal modules on one device hole. Method, that is, the method of non-metallized holes are made by a device hole intermediate portion (inner layer), which is not in communication with each other. [0003] The PCB triad process is currently processed with a partial non-gold-derived device hole structure. See figure 1 When the backplane is processed in the back diamond, after processing the PCB plate into metallized through holes, partially drilled from the front or back surface of the PCB plate into a portion ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 荀宗献张靖李超谋关志锋吴传亮朱静
Owner 珠海杰赛科技有限公司