Active and passive integrated damper based on piezoelectric array and vibration isolation method

Abstract

The invention discloses an active and passive integrated damper based on a piezoelectric array and a vibration isolation method. The damper comprises a passive damping section, a pre-tightening spring, a pre-tightening check block, a main shaft rod, a main shaft rod retaining sleeve, a linear positioning bearing and an active damping section. The passive damping section comprises a rubber ring fixing cover, an O-shaped rubber ring is arranged in the rubber ring fixing cover, a gasket is attached to the other side of the rubber ring, and a pre-tightening cover is attached to the lower end of the gasket; the active damping section comprises a piezoelectric stack array sleeve, three piezoelectric stacks are distributed in the piezoelectric stack array sleeve in an equilateral triangle mode, the three piezoelectric stacks are connected with three ejector rods through ball heads respectively, the three ejector rods abut against one end of a main shaft rod, and the other end of the main shaft rod sequentially penetrates through a pre-tightening check block and a pre-tightening spring and then is connected with the passive damping section. When vibration isolation is carried out, active vibration isolation and passive vibration isolation are combined, the multiple piezoelectric stacks are adopted to generate different displacements, radial deflection, caused by assembly errors, of the main shaft rod in the damper is compensated, and the vibration isolation effect of the damper on micro vibration is improved.

Description

technical field [0001] The invention relates to a damper, in particular to a piezoelectric array-based active and passive integrated damper and a vibration isolation method. Background technique [0002] With the rapid development of science and technology, fields such as ultra-precision machining, aerospace, laser communication, and deep space observation have higher requirements for the stability and control accuracy of their mechanical systems, and the obstacles that hinder the further improvement of the stability and accuracy of these systems An important factor is micro-vibrations from the system internal or external environment. [0003] Micro-vibration refers to micro-vibration with vibration amplitude and frequency bandwidth below the micron level. Due to the small amplitude of micro-vibration, the propagation mechanism in the mechanical structure is complicated, and the measurement of micro-vibration is easily affected by environmental noise, so it is difficult for...

AI Technical Summary

Problems solved by technology

Existing piezoelectric damping devices use piezoelectric ceramic sheets to achieve vibration reduction. Piezoelectric ceramic sheets are thin and easy to bend, and the deformation is large when vibrating, so micro-vibration cannot be well controlled.

Simply using piezoelectric ceramic materials to achieve vibration reduction will also increase energy consumption

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