Probe station

Abstract

A probe station includes a chuck configured to support a substrate; a probe card disposed above the chuck and configured to electrically test a semiconductor device formed on the substrate; a camera unit disposed above the chuck and configured to image the substrate; and a camera driving member configured to move the camera unit in a horizontal direction. The camera driving member includes a braking unit for stopping the camera unit at a predetermined position using an eddy current braking force.

Description

technical field [0001] The invention relates to a probe station. More particularly, the present invention relates to a probe station for electrically testing a semiconductor device formed on a substrate using a probe card. Background technique [0002] A semiconductor device can be formed on a substrate, such as a silicon wafer, by repeatedly performing a series of manufacturing processes. For example, in order to manufacture a semiconductor device, various manufacturing processes may be performed on a wafer, such as a deposition process for forming thin layers on the wafer, an etching process for patterning thin layers to form circuits, flattening thin layers Planarized process, etc. [0003] After the semiconductor device is formed, an electrical test process for checking electrical characteristics of the semiconductor device may be performed. The test process may be performed by a probe station including a probe card having a plurality of probes, and a test head that s...

AI Technical Summary

Problems solved by technology

However, when the movement of the upper camera unit is stopped by the stopper member, shock and vibration due to collision may occur, and since it takes a considerable time to remove the vibration, the test process for the substrate may be greatly delayed

In addition, the internal structure of the probe station may be slightly deformed by impact and vibration, and thus the contact accuracy between the substrate and the probe card may be reduced

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