High-precision wafer cutting positioning device and wafer cutting machine

Abstract

The invention discloses a high-precision wafer cutting positioning device and a wafer cutting machine, the high-precision wafer cutting positioning device comprises a base and a sliding frame arranged at the top of the base in a sliding manner, the top of the sliding frame is provided with a rotating frame, the interior of the rotating frame is fixedly connected with a supporting plate, and the supporting plate is provided with a wafer supporting assembly; a limiting column is arranged on the supporting plate in a sliding mode, and a limiting block is arranged on the top of the rotating frame in a sliding mode. A suction plate and a sliding frame are driven to move upwards, when the suction plate moves upwards and gradually makes contact with a limiting column, the limiting column can be driven to move upwards, when the limiting column moves upwards and gradually abuts against the outer circumferential face of a supporting seat, the supporting seat can be driven to move upwards through the limiting column, and therefore the top of the supporting seat abuts against a limiting block. And the supporting seat and the wafer can be positioned and fixed through the cooperation of the limiting columns and the limiting blocks, so that cutting of the wafer is facilitated.

Description

technical field [0001] The invention relates to the technical field of wafer cutting, in particular to a high-precision wafer cutting positioning device and a wafer cutting machine. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. Products; wafers need to be cut into blocks before being used as processor cores. [0003] Chinese invention patent CN109175726A discloses an automatic wafer cutting and positioning device, including: a base, a pneumatic lifting platform, a vacuum ceramic suction cup, and a mounting frame; the base is a rectangular plate structure; the pneumatic lifting platform is arranged on the upper side of the base , and the pneumatic lifting platform is connected to the base by bolts; the va...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a high-precision wafer cutting and positioning device to solve the problem that the wafer positioning and fixing structure in the process of wafer cutting in the above background technology is simple, and the stability of the wafer cannot be guaranteed during the cutting process. Once the wafer shifts during the cutting process, it will lead to the scrapping of the entire wafer board. Therefore, in actual use and production, it is necessary to optimize the positioning of the fixed structure to keep the wafer in the cutting process. stability problem

Images