Mounting jig for electrode plate of semiconductor equipment

Abstract

The invention relates to a mounting jig for a semiconductor equipment electrode plate, and the mounting jig comprises an alignment assembly which comprises a supporting disc and at least two guide shafts, the supporting disc is provided with at least two positioning holes, at least two fixing holes and at least two mounting holes, the guide shafts can penetrate through the positioning holes and positioning screw holes, and the positioning screw holes are matched with the positioning holes; one end of the guide shaft is provided with a positioning groove, the positioning groove can be connected with the positioning screw, and the fixing screw can penetrate through the fixing screw hole and the fixing hole; the driving assembly comprises a mounting plate assembly, at least two supporting rods and a driving rod assembly, the supporting rods are connected with the mounting plate assembly, one ends of the supporting rods are connected with the mounting holes, and the driving rod assembly is connected with the mounting plate assembly; the supporting assembly comprises at least two supporting seats, the supporting seats are provided with mounting grooves, and the other ends of the supporting rods are located in the mounting grooves. According to the mounting jig for the electrode plate of the semiconductor equipment, the purpose of mounting the electrode plate by one person can be achieved, and accurate positioning can also be achieved.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductor manufacturing, in particular to a fixture for mounting electrode plates of semiconductor equipment. Background technique [0002] At present, in the field of semiconductor technology, at least two operators are usually required to complete the disassembly and assembly of electrode plates of semiconductor equipment, thus wasting a lot of human resources. At the same time, during the installation process of the electrode plate, the operator also needs to manually align the screws on the fixed plate with the screw holes on the electrode plate for installation, so that the position of the lip seal ring on the fixed plate is easily damaged during the installation process. The offset will cause leakage inside the cavity, which will eventually affect the etching of semiconductors. Moreover, manual installation by operators is likely to cause collisions, thereby causing damage to the elect...

AI Technical Summary

Problems solved by technology

[0002] At present, in the field of semiconductor technology, at least two operators are usually required to complete the disassembly and assembly of the electrode plates of semiconductor equipment, thus wasting a lot of human resources

At the same time, during the installation process of the electrode plate, the operator also needs to manually align the screws on the fixed plate with the screw holes on the electrode plate for installation, so that the position of the lip seal ring on the fixed plate is easily damaged during the installation process. Offset, resulting in leakage inside the cavity, which will eventually affect the etching of semiconductors, etc.

Moreover, manual installation by the operator is prone to collisions, resulting in damage to the electrode plates and increasing the installation cost of the electrode plates

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