Packaging detection device for semiconductor production

Abstract

The invention discloses a packaging detection device for semiconductor production, and the device comprises a pedestal, a first storage battery, a second storage battery, a control button, a charging hole, a supporting cylinder, a brake ring, a radial bearing, a gear, an adjusting rod, a brake disc, a handle, a first spring, an incomplete gear ring frame, a housing, an eyepiece, an objective lens, a rubber cylinder, an illuminating lamp, an adjusting button, an arc-shaped guide rail, a supporting frame, and a swinging part. A first storage battery is fixed to the left portion of the base, a second storage battery is fixed to the right portion of the base, a control button and a charging hole are installed on the front portions of the first storage battery and the second storage battery respectively, a supporting cylinder is rotationally connected to the upper portion of the base, and a brake ring is fixed to the left end of the upper portion of the base. When the brake disc is attached to the brake ring under the action of elastic repulsive force of the second spring, the adjusting rod and the supporting cylinder cannot easily rotate, then the angle stability of the incomplete gear ring frame can be guaranteed, and therefore the stability of the observation process is guaranteed.

Description

technical field [0001] The invention relates to the field of semiconductor production, in particular to a package inspection device for semiconductor production. Background technique [0002] In the process of semiconductor production, semi-finished semiconductors need to be packaged, and the effect of semiconductor packaging will directly affect whether the semiconductor can work for a long time and with high quality. In mass production of semiconductors, machine vision is often used for automatic and rapid detection, but the detection of machine vision is often planar, and in order to ensure the detection efficiency, it can only be roughly detected, so it is necessary to extract a certain In the traditional detection method, inspectors use a magnifying glass to observe the semiconductor sample from multiple angles, so as to evaluate the packaging effect, and when using a magnifying glass to observe, holding the semiconductor sample to change the angle It is very inconveni...

AI Technical Summary

Problems solved by technology

[0002] In the process of semiconductor production, semi-finished semiconductors need to be packaged, and the effect of semiconductor packaging will directly affect whether the semiconductor can work for a long time and with high quality. In mass production of semiconductors, machine vision is often used for automatic and rapid detection, but the detection of machine vision is often planar, and in order to ensure the detection efficiency, it can only be roughly detected, so it is necessary to extract a certain In the traditional detection method, inspectors use a magnifying glass to observe the semiconductor sample from multiple angles, so as to evaluate the packaging effect, and when using a magnifying glass to observe, holding the semiconductor sample to change the angle It is very inconvenient, not only prone to wrist fatigue, but also prone to omissions, and it is easy to change the position of the sample compared to the light source when observing the semiconductor sample, which is easy to make observation inconvenience due to light problems, highlighting its shortcomings

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