Stable mounting device for chip production

A technology for stabilizing packaging and chips, which is applied in the direction of transportation and packaging, conveyor objects, electrical components, etc. It can solve the problems that affect the stability of chip components, and the stability of chip component delivery and extraction is not stable enough, so as to achieve the effect of improving the stability of extraction

Pending Publication Date: 2022-04-12
华顺玉
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, at present, chip components need to be positioned and assembled during chip production. During mounting and assembly, the delivery and extraction of chip components is not stable enough, which affects the stability of subsequent chip components for mounting.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stable mounting device for chip production
  • Stable mounting device for chip production
  • Stable mounting device for chip production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0045] Example: Please refer to Figure 1 to Figure 9 :

[0046] The present invention proposes a stable mounting device for chip production, including: a transport carrier 1;

[0047] The inner side of the conveying carrier 1 is provided with a preset loading slot 101, and the inner side of the preset loading slot 101 is provided with a drive bearing structure. , and one end of the inner side of the preset loading tank 101 is provided with a driving extrusion structure; install the pillar 2, and install the pillar 2 on the side of the two sets of bearing tooth frames 1061; assemble the carrier 3, and install the assembling carrier 3 on the top end of the conveying carrier 1 At the same time, one side of the assembly carrier 3 is provided with a driving lifting structure, and one side of the assembly carrier 3 is provided with a driving extraction structure, and at the same time, the assembly carrier 3 is provided with a linkage chute 308, and the assembly carrier 3 is provided...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a stable mounting device for chip production, and relates to the technical field of conveying and assembling devices. A pre-loading groove is formed in the inner side of the conveying loading seat, meanwhile, a driving bearing structure is arranged on the inner side of the pre-loading groove and comprises bearing tooth frames, the bearing tooth frames are installed at the two ends of the inner side of the pre-loading groove, and a driving extrusion structure is arranged at one end of the inner side of the pre-loading groove; the mounting support columns are mounted on the side surfaces of the two groups of bearing tooth frames; the assembling carrying base is installed at one end of the top of the conveying carrying base, and meanwhile a driving lifting structure is arranged on one side of the assembling carrying base; a transmission gear shaft and a lifting connecting shaft are driven to rotate through a sliding gear frame, and then a bearing stud is driven to rotate, so that a bearing extrusion seat is driven to move upwards, and the bearing extrusion seat can move upwards for pushing when a chip component is extracted; the problem that the chip component is not stable enough during conveying and extraction, so that the stability of subsequent chip component mounting is affected is solved.

Description

technical field [0001] The invention relates to the technical field of conveying and assembling devices, in particular to a chip production stable mounting device. Background technique [0002] Integrated circuits manufactured on the surface of semiconductor chips are also called thin-film integrated circuits. Another thick-film integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or circuit board. [0003] However, at present, during chip production, chip components need to be positioned and assembled. During mounting and assembly, the delivery and extraction of chip components is not stable enough, which affects the stability of subsequent chip component mounting. Contents of the invention [0004] In view of this, the present invention provides a stable mounting device for chip production, which has a driving bearing structure, a driving extrusion structure, and a driving extraction...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
Inventor 华顺玉
Owner 华顺玉
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap