Unlock instant, AI-driven research and patent intelligence for your innovation.

Digital pattern file optimization for digital lithographic apparatus

A digital pattern and digital light technology, applied in the field of digital pattern file optimization for digital lithography devices, can solve the problems of time-consuming verification and optimization processing, large processing costs, etc.

Pending Publication Date: 2022-04-12
APPLIED MATERIALS INC
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the validation and optimization process is time consuming and requires significant processing costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Digital pattern file optimization for digital lithographic apparatus
  • Digital pattern file optimization for digital lithographic apparatus
  • Digital pattern file optimization for digital lithographic apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Embodiments described herein provide a system and method for optimizing design files (digital pattern files) with reduced processing resources. The method includes dividing the optimization process into multiple steps and changing the digital pattern file between each step. Therefore, errors in the optimization process can be detected and corrected before the optimization process is completed. Additionally, dividing the optimization process into smaller steps reduces processing and time requirements compared to processing the entire design file.

[0015] figure 1 A digital lithography system 100 is shown in accordance with one or more implementations. The system 100 includes a digital lithography apparatus 101 and an optimizer 130 . The digital lithography apparatus 101 includes a platform 114 and a processing device 104 . Platform 114 is supported by a pair of rails 116 provided on plate 102 . Platform 114 supports substrate 120 . Platform 114 is supported by a p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A digital pattern generation system includes a memory and a controller. The controller is coupled to the memory and is configured to remove the redundant unit from the digital pattern file, generate a first updated digital pattern file, and compare the first updated digital pattern file to the digital pattern file. Further, the number of vertices of the first arc of the first updated digital pattern file is reduced to generate a second updated digital pattern file. Further, the first unit of the second updated digital pattern file is replaced with an alternative version of the first unit to generate a third updated digital pattern file. Further, one or more polygons in the third updated digital pattern file are converted to one or more quadrilateral polygons to generate an optimized digital pattern file.

Description

technical field [0001] Embodiments of the present disclosure generally relate to generating design files for digital lithography systems. Background technique [0002] Photolithography is used in the manufacture of semiconductor devices. Conventional photolithography methods involve transferring the design pattern onto a set of photomasks, which are transferred onto a photoresist. Given the original design, the photomask is inspected to verify the accuracy and quality of the photomask. However, transferring the design patterns onto a set of photomasks and verifying the accuracy and quality of the photomasks is a time-consuming and expensive process. In the digital lithography process, an imaging process is used to digitize the design pattern directly onto the photoresist. In addition, the digital lithography process includes a verification process to verify the accuracy of the designed pattern and to optimize the designed pattern for the imaging process. However, the val...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20H01L21/027
CPCG03F7/70433G06F30/398H01L27/0207
Inventor 康宗勋托马斯·拉伊迪董银锋杨耀程洪诚谦希瓦拉加·古鲁拉加·卡马拉普拉高再传
Owner APPLIED MATERIALS INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More