Electromagnetic shielding packaging structure, electronic device module and manufacturing method thereof

Abstract

The invention provides an electromagnetic shielding packaging structure, an electronic device module and a manufacturing method thereof, and belongs to the technical field of semiconductor electronic device modules. The electromagnetic shielding packaging structure comprises a first shielding piece, a second shielding piece and a lead, the two ends of the lead are conductively connected to the first shielding piece respectively, a connecting part is arranged between the two ends of the lead, and the connecting part is bent and conductively connected to the second shielding piece; the electronic device module comprises the electromagnetic shielding packaging structure and further comprises an electronic component, and the electronic component is arranged between the first shielding piece and the second shielding piece. The manufacturing method of the electronic device module comprises the following steps that the two ends of the lead are conductively connected to the first shielding piece, the connecting part is bent in the direction away from the first shielding piece, and the connecting part is conductively connected to the second shielding piece. The shielding effect is good, high-density integration of multiple electronic devices is facilitated, the lead strength is improved, deflection and toppling are not prone to occurring, and machining and manufacturing are convenient.

Description

technical field [0001] The invention relates to semiconductor electronic device module technology, in particular to an electromagnetic shielding packaging structure, an electronic device module and a manufacturing method thereof. Background technique [0002] At present, a metal frame and a cover are usually installed on the circuit board to realize electromagnetic shielding of the internal circuit of the radio frequency module. The electronic components inside the module are isolated by the shielding partition wall set inside the metal frame. In the existing process, the metal frame and the cover are welded together by parallel seam welding. The cover can only be connected around the outer frame of the metal frame, but the top of the shielding partition inside the metal frame and the cover cannot be welded. , It is prone to poor contact connection and poor conduction, resulting in poor electromagnetic shielding effect between compartments. In addition, the thickness of th...

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Problems solved by technology

[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide an electromagnetic shielding packaging structure, an electronic device module and a manufacturing method thereof, which are used to solve the problem of poor electromagnetic shielding effect between compartments in the prior art and difficulty in high-density integration problem

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