2results about How to "High density integration" patented technology

This application relates to the field of flexible electronics technology, and more particularly to multilayer flexible electronic devices, their fabrication methods, and applications. The fabrication method includes: providing a film unit, comprising a flexible film and a circuit bonded to a surface of the flexible film, wherein the surface of the film unit with the circuit bonded is designated as a first surface, and the surface opposite to the first surface is designated as a second surface; immersing the film unit and a first substrate in a liquid, performing a first bonding treatment on the first surface and the surface of the first substrate, and removing the film unit from the liquid to obtain a film composite unit; using the first surface of the film unit that has not undergone the first bonding treatment as a front surface, and the second surface of the film composite unit as a rear surface, performing a second bonding treatment on the front and rear surfaces; peeling the first substrate in the film composite unit after the second bonding treatment, so that the first surface in the film composite unit forms a new front surface; repeating the second bonding treatment and peeling treatment steps to obtain a multilayer flexible electronic device.

This utility model relates to the field of hydrogen energy technology, and in particular to an integrated multi-functional high-pressure hydrogen cylinder valve. It includes a main control solenoid valve, a manual valve, an overflow valve, a venting valve, and a temperature-driven venting device mounted on the valve body. All of these components are located on the side of the valve body. This utility model employs an internal channel layout, integrating multiple modules such as the main control solenoid valve, manual valve, overflow valve, and temperature-driven venting device. This significantly simplifies the pipeline structure, reduces leakage risk, and achieves a revolutionary structure characterized by high-density integration, ultra-thin flatness, and high reliability maintenance.