Lamination sheet type coil integration member and manufacturing method thereof

Abstract

The invention provides a lamination sheet type coil integration member, comprising at least two coils and a plurality of insulating layers. Each coil comprises multi-layer electrode patterns connected layer upon layer in a spiral shape, the electrode pattern layers in different coils are embedded, staggered and overlapped with each other, the insulating layers are positioned between the adjacent electrode pattern layers in the different coils at intervals, and the adjacent electrode pattern layers in the same coil are electrically connected with each other by spanning the insulating layers positioned between the same. The invention also provides a forming method of the lamination sheet type coil integration member. The multi-layer electrode patterns of the two coils of the lamination sheet type coil integration member are embedded, staggered and overlapped with each other, thereby enhancing the utility ratio of space, the force factor of the coils and the integration density, being suitable for the requirement of the high-density assembly of a surface mounting technique and also being used for an inductance component, common mode signal inhibition, signal transformation, voltage change, and the like.

Description

【Technical field】 [0001] The invention relates to an electronic integrated part, in particular to a laminated chip coil integrated part and a manufacturing method thereof. 【Background technique】 [0002] With the continuous miniaturization of electronic equipment, the corresponding components are becoming more and more miniaturized, sliced ​​and integrated. At present, the miniaturization size of components is approaching the limit, so in order to further improve space utilization, integration is an inevitable trend. Typical miniaturized components such as printed circuit boards, especially multi-layer printed circuit boards are indispensable structures for the integration of electronic components. [0003] In addition to making well-known integrated circuit boards, multilayer printed circuit boards can also use their lamination technology to manufacture laminated chip inductors, capacitors, transformer windings, and LC filters. Taking inductors as an example, traditional ...

AI Technical Summary

Problems solved by technology

Although the space utilization rate has been improved to a certain extent through the integration method, this method is equivalent to integrating multiple small-size inductors into one large-size inductor, and the improvement rate of the space utilization of the entire inductor is not high.

Images