Graphene film and graphene film enhanced heat conduction composite film
A technology of graphene film and heat conduction composite, which is applied in the direction of materials, chemical instruments and methods for modification and heat exchange through conduction and heat transfer, can solve the problems of low thermal conductivity and low strength, and achieve high thermal conductivity and high The effect of intensity and condition is easy to control
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Embodiment 1
[0043] A kind of preparation method of graphene film reinforced heat conduction silicone rubber composite film, comprises the steps:
[0044] (1) Select the low-density graphene film with airtight bubble structure without calendering, the density of graphene film is 0.2g / cm3, the thickness of film body is 300 μ m, and the average diameter of bubbles inside the film body is 30 μ m, the graphene film In-plane thermal conductivity is 400W / mK;
[0045] (2) The through-holes through the upper and lower surfaces are formed on the graphene film by needle roller punching, the diameter of the through-holes is 50 μm, the spacing of the through-holes is 0.5 mm, and the number of through-holes per square centimeter is 400;
[0046] (3) One-component silicone rubber is used, and the viscosity of the one-component silicone rubber is adjusted to 10cP by diluting the one-component silicone rubber with tetrahydrofuran solvent; the one-component silicone rubber diluted with tetrahydrofuran is s...
Embodiment 2
[0050] A kind of preparation method of graphene film reinforced heat conduction paraffin composite film, comprises the steps:
[0051] (1) Select the low-density graphene film with airtight bubble structure without calendering, the density of graphene film is 0.1g / cm3, the thickness of film body is 500 μ m, and the average diameter of bubbles inside the film body is 10 μ m, the graphene film In-plane thermal conductivity is 300W / mK;
[0052] (2) A laser drilling method is used to form through holes through the upper and lower surfaces on the graphene film. The diameter of the through holes is 10 μm, the spacing of the through holes is 0.25 mm, and the number of through holes per square centimeter is 1600;
[0053] (3) adopting the paraffin that melting temperature is 60 ℃, by heating at 80 ℃ to form the paraffin fluid of molten state, the viscosity of paraffin fluid is 80cP;
[0054] (4) immerse the graphene film after perforation in the above-mentioned paraffin fluid in the ...
Embodiment 3
[0057] A kind of preparation method of graphene film reinforced thermal conductivity epoxy resin composite film, comprises the steps:
[0058] (1) Select the low-density graphene film with airtight bubble structure without calendering, the density of graphene film is 0.5g / cm3, the thickness of film body is 100 μ m, and the average diameter of bubbles inside the film body is 20 μ m, the graphene film In-plane thermal conductivity is 500W / mK;
[0059] (2) The through-holes through the upper and lower surfaces are formed on the graphene film by plasma drilling, the diameter of the through-holes is 10 μm, the spacing of the through-holes is 1 mm, and the number of through-holes per square centimeter is 100;
[0060] (3) Mix epoxy resin A and B components uniformly in proportion, and adjust the viscosity to 20cP by acetone;
[0061] (4) immerse the graphene film after perforating in the acetone solution of above-mentioned epoxy resin, immersion time is 10 minutes, utilizes vacuum ...
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