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Graphene film and graphene film enhanced heat conduction composite film

A technology of graphene film and heat conduction composite, which is applied in the direction of materials, chemical instruments and methods for modification and heat exchange through conduction and heat transfer, can solve the problems of low thermal conductivity and low strength, and achieve high thermal conductivity and high The effect of intensity and condition is easy to control

Inactive Publication Date: 2022-04-22
苏州南诣科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the technical defects of low thermal conductivity and low strength of graphene polymer-based composite materials, and to provide a graphene film reinforced with a low-density graphene film with a closed bubble structure that has not been calendered. A method for thermally conductive composite film, the method is simple to operate and the conditions are easy to control

Method used

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  • Graphene film and graphene film enhanced heat conduction composite film
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Examples

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Effect test

Embodiment 1

[0043] A kind of preparation method of graphene film reinforced heat conduction silicone rubber composite film, comprises the steps:

[0044] (1) Select the low-density graphene film with airtight bubble structure without calendering, the density of graphene film is 0.2g / cm3, the thickness of film body is 300 μ m, and the average diameter of bubbles inside the film body is 30 μ m, the graphene film In-plane thermal conductivity is 400W / mK;

[0045] (2) The through-holes through the upper and lower surfaces are formed on the graphene film by needle roller punching, the diameter of the through-holes is 50 μm, the spacing of the through-holes is 0.5 mm, and the number of through-holes per square centimeter is 400;

[0046] (3) One-component silicone rubber is used, and the viscosity of the one-component silicone rubber is adjusted to 10cP by diluting the one-component silicone rubber with tetrahydrofuran solvent; the one-component silicone rubber diluted with tetrahydrofuran is s...

Embodiment 2

[0050] A kind of preparation method of graphene film reinforced heat conduction paraffin composite film, comprises the steps:

[0051] (1) Select the low-density graphene film with airtight bubble structure without calendering, the density of graphene film is 0.1g / cm3, the thickness of film body is 500 μ m, and the average diameter of bubbles inside the film body is 10 μ m, the graphene film In-plane thermal conductivity is 300W / mK;

[0052] (2) A laser drilling method is used to form through holes through the upper and lower surfaces on the graphene film. The diameter of the through holes is 10 μm, the spacing of the through holes is 0.25 mm, and the number of through holes per square centimeter is 1600;

[0053] (3) adopting the paraffin that melting temperature is 60 ℃, by heating at 80 ℃ to form the paraffin fluid of molten state, the viscosity of paraffin fluid is 80cP;

[0054] (4) immerse the graphene film after perforation in the above-mentioned paraffin fluid in the ...

Embodiment 3

[0057] A kind of preparation method of graphene film reinforced thermal conductivity epoxy resin composite film, comprises the steps:

[0058] (1) Select the low-density graphene film with airtight bubble structure without calendering, the density of graphene film is 0.5g / cm3, the thickness of film body is 100 μ m, and the average diameter of bubbles inside the film body is 20 μ m, the graphene film In-plane thermal conductivity is 500W / mK;

[0059] (2) The through-holes through the upper and lower surfaces are formed on the graphene film by plasma drilling, the diameter of the through-holes is 10 μm, the spacing of the through-holes is 1 mm, and the number of through-holes per square centimeter is 100;

[0060] (3) Mix epoxy resin A and B components uniformly in proportion, and adjust the viscosity to 20cP by acetone;

[0061] (4) immerse the graphene film after perforating in the acetone solution of above-mentioned epoxy resin, immersion time is 10 minutes, utilizes vacuum ...

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Abstract

The invention discloses a graphene film enhanced heat conduction composite film, which comprises one or more layers of graphene films, each graphene film is provided with a plurality of through holes penetrating through the upper surface and the lower surface of the graphene film, and the through holes are filled with polymers. The graphene layer in the graphene film reinforced heat-conducting composite film keeps the structural continuity, and meanwhile, the graphene layer and the polymer are staggered together, so that compared with a common graphite / polymer laminated structure or a graphite filler type compound, the graphene film reinforced heat-conducting composite film has higher strength and higher heat conductivity; the graphene film enhanced heat conduction composite film prepared by the invention is wide in application, and can carry different polymer systems aiming at different application environments to realize specific requirements except heat conduction requirements, such as flexible application, heat absorption / dissipation application, mechanical enhancement application and the like.

Description

technical field [0001] The present invention relates to the technical field of preparation of graphene composite materials, more specifically, to a graphene film-reinforced heat-conducting composite film and its preparation method and application, in particular to a method of sealing pores inside an unrolled low-density graphene film Process and use of opening and pouring polymers to form composite membranes. Background technique [0002] With the miniaturization, multi-functionality and high-performance of electronic products, the heat dissipation performance of traditional polymers has an increasing impact on the life and performance of electronic products. For example, silicone rubber and polyurethane have high elasticity and high deformation capacity. It is usually used as a substrate in wearable devices or various flexible devices, but their weak heat dissipation will have various adverse effects on the life and performance of electronic devices, and will reduce the use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L83/04C08K3/04C08L91/06C08L63/00C09K5/14H05K7/20
CPCC08J5/18H05K7/2039C09K5/14C08J2383/04C08K3/042C08J2391/06C08J2363/00C08J5/0405C08J2391/08
Inventor 王楠
Owner 苏州南诣科技有限公司